SAMSUNG ELECTRONICS CO., LTD. (Suwon-si, KR)
The invention relates to an electronic device, which includes the housing structure.
2. Description of related art
A device that is electronic could comprise the display module, which has an oblique screen, window glass protecting it, and a housing around the glass’s edge. The electronic device might also comprise a rear-facing case at the rear of the housing as well as rear glass that is arranged on the back of the rear case to give a sense of aesthetic to a rear surface of the device.
The bezel’s area to connect the glass to the housing has been gradually reduced to meet the demands of consumers lately, an adhesion strength that is greater than a certain amount could be difficult to attain.
A bonding material that bonds the housing and window glass can be used between the housing and the glass in order to meet the requirements for strength and exterior of the electronic device.
In the electronic device, the bonding material can leak out of the glass window and the housing, and thus, the bonding material may be seen by users.
This device is electronic and has better coupling strength between a window and a housing, while still retaining an aesthetic.
Other aspects will be set forth in part in the description following and, in a part, will be obvious from the description or may be learned by application of the described embodiments.
In accordance with an aspect of the disclosure, there is an electronic device that includes a transparent member that is positioned on at least a front surface or a rear surface of the electronic device and with a first surface which faces a display module, and a housing around the transparent member and comprising a sidewall extending in a direction that is circumferential to the electronic device, providing an exterior for the electronic device, as well as protruding parts protruding toward the transparent member from the sidewall and expanding in the circumferential directions of the electronic device, wherein a distance between the protruding portions facing each other, and having the transparent member therebetween is less than a width of thetransparent member arranged between the protruding parts, and top end parts of the protruding portion are higher than the first section of the transparent members in a direction of thickness of the electronic device.
The protruding areas could comprise the protruding area that extends in an upward direction of electronic devices in the direction of the thickness being perpendicular. Members that are transparent may have a left length that is extended in a perpendicular direction to the thickness direction and the upward direction of electronic devices. The distance between the protruding first region and the transparent member may be smaller than the left width of the transparent member.
Protruding areas could also contain second protruding areas that extend to the left and right directions of the electronic gadgets. This is because the transparent members may have an up-down width that is perpendicular to the thickness direction and left direction of the electronic device. The distance between protruding parts facing each other and the transparentmember may be less than the up-down width.
The transparent member may comprise a second area in an area that is a portion of the first region and including a certain thickness. The second region of the transparent part has one opposing surface facing the sidewall and a second opposing surface that faces the protruding regions.
Further, the electronic device may have a moving path between the second surface as well as protruding parts, and the bonding member moves. The path of movement is located in a step region between the topend portions protruding part and the first region in the transparent member.
The top-end portions of the protruding portion may be located in the same locations in relation to a bottom end portion of the first opposite surface in the thickness direction of the electronic device.
The second opposing surface may be a sloped surface forming a certain angle with respect to either the front or rear of the device, and the protruding parts could include inclined surfaces that are opposite to the opposing surface.
The surfaces with incline and the opposite surface might have different inclinations in relation to one another.
The second surface could be a sloped or sloping surface that forms an angle that is a specific angle to either the front or the rear of the electronic device and the protruding parts could include curved surfaces that are opposite to the second opposing surface.
The curved surfaces could be situated under the illusion of a plane that runs parallel to the sloped area.
The second surface could be a surface that is curved with a certain curvature. The areas that protrude could be curved and opposite to the surface on which they are.
The curvature of the opposite surface may be different or the same as that of the protruding surfaces.
The electronic device could also comprise a variety of projection areas arranged on one or more of the opposing surface and the inclined surfaces.
The electronic device could also include a coating portion arranged on one or two of the opposing surface and the inclined surfaces to enhance the frictional force of the bonding member.
The protruding parts could include top surface portions of planar shapes , and are joined to the sidewalls and top ends of the inclined surfaces.
The electronic device may further include a transparent member support portion extending in a circular direction around the transparent member and supporting the bottom of the transparent member.
Electronic devices may have a bonding members accommodating part that is placed between the protruding parts and the transparent support portion of the member in order to allow for bonding.
The accommodating portion of the bonding member could include a bonding accommodating surface below the transparent member in the direction of thickness of the electronic device. It also includes a groove that accommodates the bonding members located lowerthan the bonding member accommodating surface in the thickness direction of the electronic device.
The first groove for accommodating may be located beneath the bonding member accommodating surface in thickness direction of electronic device. The second accommodating groove region could be smaller than the protruding parts.
The cross-sectional area of the bonding members accommodating groove can include one or more of the following shapes: a triangular, semi-circular or rectangular.Click here to view the patent on USPTO website.
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