Communications – Gary D. McCormack, Ian A. Kyles, Roger D. Isaac, Keyssa Inc
Abstract for “Virtualized physical Layer adapted for EHF contactless communications”
A Physical Layer (PHY), which is a part of an electronic device’s host system, may be used for contactless (cPHY), extremely high frequency (EHF), contactless communication and operation of EHF transmitters and receivers (RX), and transceivers in an extremely high frequency integrated (EHFIC) of the electronic devices. The Host cPHY converts logical communications requests from Link Layer (LINK), into hardware-specific operations that affect transmission or receipt of signals over an EHF-contactless link. For EHF contactless communication, the Link Layer (LINK), may be optimized to function as a contactless link layer (cLINK). Virtualized contactless physical layer (VcPHY), which may include a contactless physical layer (Host cPHY), and contactless link Layer (cLINK) to couple a conventional Link Layer, (LINK), with the contactless physical layer (Host cPHY). Multiple data streams can be transmitted over the EHF contactless line over a variety of frequencies.
Background for “Virtualized physical Layer adapted for EHF contactless communications”
It is important to “connect” electronic devices. “It is often important to “connect” electronic devices. This allows them to communicate with each other, transfer data, or just communicate between them. Exemplary data being transferred between devices may comprise a media file (such as an image file, an audio file, a video file), DRM (digital rights management) protected content, an OS (operating system) update, customer specific code, OEM (original equipment manufacturer) specific code, retail specific code, a firmware image for the destination device, user data, encryption/decryption keys (codes), electronic funds transfer (EFT) data, static data and the like.”
“In the description herein, one device participating in a communication link may be called a?source?” The sending (or sending) device is referred to as the?source?, while the other device can be called a ‘destination? Or a?sink?” (or receiving) device. These devices can also be called a “partner?” device. It is important to understand that data can be transferred between both devices in one or both directions.
“Some electronic devices that may benefit from the methods disclosed herein include, but not limited to, cell phones (or smart phones), computers and laptops, tablets, and other similar electronic devices.”
“Communications between two devices typically consist of a wired or cabled connection. A cabled connection, such as USB (Universal Serial Bus), is usually point-to-point and requires mechanical connectors at each end and a cable connecting the two devices (one device may be a hub?). Connecting point-to-point to several other USB-enabled gadgets. Wireless connections such as Bluetooth or WiFi operate in a more broadcast-like mode. Mode, in which one device can simultaneously communicate with multiple devices over a radio frequency link (typically between 700 MHz and 5.8 GHz).
“Mechanical connectors can only be used to connect, but they are passive and do not offer any additional capabilities or features. The connection will either be working or not. The terms “Host System” and “Host IC” are interchangeable. Alternatively,?Host IC’ or?Host System? are used interchangeably. Refers to any device, or part thereof, that can include an integrated circuit (or more) that implements functionality required to communicate with a connector. In setting up the communication link, the host system behind the connector may do some initial analysis, including detection and enumeration devices connected. This can be time-consuming and generally the link operates until it fails. A host system can be programmed to try to restore the link after it has failed. This can be cumbersome.
“Mechanical connectors are at risk for breakdown either due to wear and tear or due to the use of inappropriate force applied when inserting/de-inserting the connectors. Mechanical connectors are costly to make due to the risk of failure and the high cost of manufacturing them.
It is difficult to use multiple connectors to transfer different protocols data. Each protocol data transmission will require a different connector and cable. There is a limit to the length of the cable that can be used. Data transfer at multiple-Gbps over a long cable causes signal reliability issues at receivers. This could be compensated either at receiver or transmitter ends, but it increases power dissipation as well as system complexity.
“A wireless connection like Bluetooth or WiFi works in a more broadcast? Mode, in which one device can simultaneously communicate with multiple devices over a radio frequency link (typically between 700 MHz and 5.8 GHz).
“Point-to-point connections-oriented techniques for data transmission between two electronic devices are the focus of this article. Near Field Communication (NFC) is an example of a wireless connection-oriented point-to-point communications link that allows data transfer between electronic devices. NFC is a standard for smartphones and other similar devices that establish radio frequency communication (RF) with one another by touching (?bumping?) They can be brought together or brought into close proximity to one another.
“Terms and definitions”
“The following terms can be used in the descriptions herein:
The acronym “EHF” stands for Extremely High Frequency. “EHF” stands for Extremely High Frequency and refers to a part of the electromagnetic spectrum (EM) in the radio frequency range (30 GHz to 300 GHz (gigahertz).
“Electronic devices can be referred to as?devices’ in this document.
“?Host systems? Refers to integrated circuits capable of establishing, maintaining and/or terminating communications with other integrated circuits.
“Contactless” refers to the implementation of electromagnetic (EM) connections and transporting signals between entities (such devices). The term “wireless” is used in some literature. This term is used to express this meaning. The term “contactless” is used in this context. The term ‘contactless? may be used to refer to a carrier assisted, dielectric coupling device that may have an optimal range of zero to five cm (also known as?close proximity?). Contactless link is another term. A communication link that does not use a contactless method of communication is called a “contactless link”. A connection can be established by the proximity of one device and another device. Multiple receivers and transmitters can occupy small spaces. An electromagnetic link may only be used for contactless transmissions. A wireless connection, on the other hand, can send information to multiple points.
“Contactless connector” is a term that refers to a type of connector called. This refers to a group of connectors that include the contactless function. It may also include passive components, integrated circuits, shielding materials, structures, and any other components necessary to integrate the contactless connector into a device.
“Contactless subsystem” is a term that refers to a subsystem. A subsystem that can be integrated into a contactless connector. It may include integrated circuits that enable data transmission or receipt. They may also perform other functions such as power management, support active or passive circuitry and antenna or transducer. One part of the active circuitry can be implemented as an integrated circuit (also known as the?EHFIC?). This is part of the contactless system and may include transmitter(s), receivers, and interfaces with the contactless medium as well as an electrical interface.
The terms chip, die (or integrated circuit), semiconductor device, and microelectronic devices are all used interchangeably in common usage and may be used interchangeably in this document. These terms may also include packaged chips (or chips), bare chips (or chips), and chips modules and packages. The techniques disclosed herein may be implemented with integrated circuits (ICs) using standard CMOS (Complementary-Metal-Oxide-Semiconductor) processes. Some functions that are described as being implemented with chips can be implemented as macro-functions in application specific integrated circuits, ASICS, or the like. Or, alternatively, software running on a microcontroller may be used to implement at least some of these functions. With respect to chips, various signals may be coupled between them and other circuit elements via physical, electrically-conductive connections. This point of connection can be called an input, output (I/O), terminal or line, pin pad, port, interface or other similar variants.
“The term’microprocessor’ is used interchangeably with the term “microprocessor”. “The term?microprocessor?” (?P) or simply?processor? may be used to refer to either a microcontroller or microprocessor (?C). A microprocessor is an integrated circuit (IC) that only has the CPU (central processing units) inside. It does not have RAM, ROM or other peripherals. A microcontroller generally has a CPU and a fixed amount RAM (random access memory), read only memory (ROM) and other peripherals. These chips are typically used to perform specific tasks that have a defined relationship between input and output. The input usually requires some processing before the output can be delivered.
“The term “adapted” may be used to mean that the referenced device, IC or part of an IC, or a functional block is either designed, dedicated. “Adapted” could be used to indicate that the referenced device or part of an IC or a functional bloc is either designed, dedicated or arranged to meet a specific requirement.
“?Standards? “?Standards?” and similar terms like?Standards based?, interfaces based on standards?, protocol based on standards?. The term “wired interface standards” may also be used to refer to the following: USB, DisplayPort, Thunderbolt (DP), HDMI, SATA/SAS (PSA), Thunderbolt), HDMI, SATA/SAS/AS, PCIe and Ethernet SGMIII. Quickpath, I2S and GPIO as well as their extensions and revisions.
“The Physical Layer (??PHY?)”
The Physical Layer (PHY), which provides an electrical interface to a transmission medium, defines physical characteristics like connections, voltage levels, timing and the means of transmitting raw bit rather than logical data packets via a physical link. A bit stream can be broken down into code words and symbols, which are then converted into a physical signal to be transmitted over a transmission medium. The reference to PHY could also refer to its implementation in a semiconductor device.
“A Standards-based PHY includes the PHY specifications from one or more Standards.”
“Examples of notations are:
“The Data Link Layer (??LINK?)”
“The Data Link Layer may encode bits into packets before transmission and then decode the packets back into bits at destination. It may provide reliable data transfer by transmitting the required synchronization error control and flow control. The LINK can be sub-layered, including the media access control sublayer (MAC) and the logical control sublayer (LLC).
“It should be understood that a reference LINK could refer to one or more functionalities that the LINK might be incorporated into a system in a particular layered stack configuration, as defined by the respective standards or proprietary protocols.”
“A Standards-based LINK includes the LINK functions from one or more Standards.”
“A contactless LINK?cLINK?” A LINK is a link that allows communication between a host system (?cLINK?) and an EHF IC. This allows the host system to and/or EHF IC both to optimize the contactless and electrical links.
“Term?transmitter” “The term?transmitter” can be abbreviated as?TX). could refer to a device, or an IC, that can be used to transmit data (information). The term “receiver” is sometimes abbreviated as?RX? The term?receiver? (also known as?RX?) may be abbreviated. could refer to a device (or an IC) that can be used to receive data (data). The term “transceiver” is used. The term?transceiver’ can be abbreviated as?XCVR? may refer to a device, or an IC, that includes a TX and a RX portions, often sharing some circuitry, so that the IC can be used to transmit and/or receive data. A transceiver (XCVR), in general, can be used in either a half-duplex (alternating between transmitting/receiving) or full-duplex (transmitting/receiving simultaneously). It may also be configured as either a transmitter (simplex mode) or as a receiver (simplex). Separate TXs or RXs can be used in some embodiments instead of XCVRs. When the term?XCVR? is used, it should be understood to include separate RXs and TXs. If transceivers, transmitters, or receivers are referred to in the plural, then the singular form of TX, RX, or XCVR may be used instead of XCVRs TXs, or RXs. Prefixes used with terms?XCVR,??TX,???RX? refer to the specific communication medium with which they interface and the device or IC in which they reside.
“An example list includes:”
“Generation I (Gen I?) Contactless Subsystem
“In a Gen I Contactless Subsystem, a significant part of control and management for the contactless link is done in the EHF IC and a substantial portion of control and management for the electrical link are performed in host system. An EHF IC can also be designed to comply with any of the Standards that are applicable to its interface with the host. An EHF IC-based contactless system or device that includes an EHF IC may be referred as a Gen I device.
“Generation II (Gen II) Contactless Subsystem
“In a Gen II Contactless Subsystem, a significant part of control and management for the contactless link or the electrical link is done in the host system. Both the EHF IC or the host system can be designed to maximize performance on both contactless and electric links. Gen II devices may include an EHF IC, contactless subsystem or device that is based on a Gen II subsystem.
“Serializer/Deserializer (?SERDES?)”
“Part of PHY that implements one or both of the serializer and deserializer functions(s).
“It is the general object of the invention that improved communication techniques between electronic devices be provided, which may include some techniques to incorporate EHF contactless communication capability into the device, such as by changing the PHY or the LINK of the host system.
These and other objects can be accomplished by removing mechanical connectors and wires and using contactless connectors and an electromagnetic communications link. A contactless subsystem that is associated with a device’s host system may include at least one EHFXCVR, separate EHFXTX and EHFX-RX, as well as associated transducers and antennas for converting between electrical and EM signals.
“Accordingly to some embodiments, the invention described herein, a given electronic gadget may comprise a contactless system and a host-system having a Standards based PHY.”
“Accordingly to some embodiments, the invention disclosed herein, a given electronic gadget may be based upon a Gen II contactless system interfacing with a Host System.”
“Accordingly to some embodiments, the host system may include Standards-based interfaces. It may also contain a Standards-based LINK such as a LINK that is compatible with the DisplayPort protocol (DP). A SERDES may also be part of the host system. One or more EHF ICs may be included in the EHF IC, or alternatively one or two EHF TXs or EHF RXs.
According to certain embodiments of the invention, the data and control block (or functions such as measurement or control circuits) may be separated from the EHF IC and integrated into the host system. This allows the EHF signaling section of an EHF IC to be simplified and integrated into an EHF IC that focuses primarily on the analog or RF portion of contactless communication over the callless link.
“Accordingly to some embodiments disclosed herein, the PHY within an electronic device’s host system may be replaced or modified or augmented with a Host cPHY that is able to use EHF contactless communications and the operation EHF EHF ICs. The Host cPHY can translate logical communication requests from the LINK to hardware-specific operations that influence (implemente, control, manage, and manage) the transmission or reception signals over the EHF Contactless Link. An EHF-cPHY within the EHF IC can handle signals between the Host-cPHY or PHY in a host-system of the device and EHF IC. The LINK in a host system of the device could also be optimized to allow for EHF contactless communications. The signaling between the Host cPHY and EHF IC can be done using either analog or digital signaling or both. It is possible to use Gen II devices with a Host cPHY and Gen I devices with a Standards-based HY. Multiple data streams can be transmitted over the contactless link at different frequencies.
According to certain embodiments of the invention (or simply?VcPHY), a virtualized contactless physical layer (?VcPHY?) is generally used. A Host-cPHY is an arrangement (adaptation, implementation, configuration, defined, and possibly combined with the cLINK) that allows seamless communication between devices. VcPHY is an interface that can be used to electrically connect with an EHF IC capable of contactless communication. The EHC IC can communicate with an EHF IC or with a contactless connector using an EHF contactless connection.
A VcPHY can contain a Host cPHY that has some of the LINK or the cLINK functionality. The VcPHY may include LINK functionality that functions to connect a Standards-based link with the Host cPHY. The resulting VcPHY could have LINK functionality directed at the contactless link. It may also have PHY functionality directed towards the electrical connection between host system and EHF IC. The VcPHY can manage the contactless connection to perform functions based upon the protocol data to be sent over the contactless line and the environment in which it is being implemented.
Contactless communication may allow data transfers at multiGbps rates comparable to traditional wireline communications. However, contactless communication has some fundamental advantages. These include the absence of mechanical connectors, the associated benefits in terms of cost reliability, cost, ease of use, power dissipation and silicon footprint. Many of these benefits may be possible with the Host-cPHY or the cLINK. VcPHY can further enhance the use of contactless connectors. It simplifies the integration of EHF ICs in host systems and devices. This allows for greater flexibility in transmitting a variety protocol data over the contactless link while requiring minimal protocol-related operations. Some embodiments make use of the processing power of a host system, which may include a processor/a controller to direct or control the EHF IC’s functionality. This may improve the overall power dissipation of the system and the silicon footprint. The EHF IC’s implementation can be made simpler by allowing the host system to play a greater role in contactless communication. The EHF IC might primarily have analog blocks, which are mainly directed at maintaining EHF signaling over the contactless link. This makes the EHF IC easier to implement and can simplify any logical or processing operations required in the EHF IC.
According to certain embodiments of the invention, an electronic system may include: a host (Host IC), operating with an Open Systems Interconnection network architecture consisting of a Physical Layer and a first Standards based Link Layer. A contactless Physical Layer is used to transmit and receive signals over the EHF Contactless Link via the EHF IC. The second Link Layer (cLINK), may contain functionality directed at the contactless link. The functionality of the second Link Layer (cLINK), may be directed at the electrical connection between host system and EHF IC. The second Link Layer (cLINK), may be used to allow the first Link Layer to communicate with the virtualized, contactless PHY (VcPHY). This is similar to the VcPHY being a Physical Layer implementation according to a specific Standards’ specification. Display Port, HDMI and PCIe are all possible options. Each of the first and second Link Layers could share at least one function. The second Link Layer (cLINK), may be capable of performing at least one function that is directed towards the enabling and maintaining contactless links. The second Link Layer (cLINK), may be able to perform at most one of beaconing, polling, and security verification functions. The first conventional Link Layer may be able to listen for EHF contactless links or perform beaconing. It may also be able to set the link parameters of at most a segment of path that couples the first traditional Link Layer and the contactless EHFIC. The second Link Layer, cLINK, may be able to set the parameters for at least one segment of the path that links the second Link Layer cLINK and the contactless EHFIC IC. The second Link Layer (cLINK), may be able to set parameters for the contactless link. The first link training operation for the contactless line may be directed by the first conventional Link Layer (LINK). An electronic device can include a plurality LINKs, a plurality VcPHYs, and a plurality at least one transceiver (EHFXCVR). A plurality of LINKs may be included in the electronic device. One VcPHY can also be used. In this case, a particular LINK is connected selectively to the single VcPHY at a time. Multiple LINKs, multiple VcPHYs, and a switch routing data stream between the multiple links and multiple VcPHYs may be included in the electronic device. Multiple EHF ICs may be included in the electronic device. One or more LINKs, an associated EHF IC, an Ethernet protocol stack and an EHF IC may make up the electronic device. Two EHF ICs, a host system with a first VcPHY and a second host systems with a second VcPHY may be part of the other electronic device. The electronic device can include at least two VcPHYs, and at least two EHFICs. Additionally, the other electronic device could contain a network processor. The electronic device can contain at least two VcPHYs with at least two EHFICs. Another electronic device could include a bridge chip.
According to certain embodiments of the invention, a method for communicating between electronic devices using an EHF Contactless Communications Link, at least one electronic device with a host system and EHF IC (EHF IC) may be described as: providing at minimum one electronic device with a virtualized physical layer (VcPHY), which is dedicated to EHF direct communication over the EHF contactsless communications link. The virtualized physical layer-based contactless physical layer (VcPHY), may include a contactless Physical Layer, (Host cPHY), which can be used to implement interface specifications and medium needs for sending and receiving signals over EHF contactless communications links. A virtualized virtualless link based Physical Layer(VcPHY), may also contain a contactless Link Layer (cLINK), which may functionally link a conventional Link Layer or LINK with the virtualized virtual contactless linked-based Physical Layer. The contactless Link Layer, (cLINK), may be directed at the contactless link or (ii) function directed towards the electrical connection between host system and EHF IC. To isolate the Link Layer from the EHF contactless communications, the contactless link layer (cLINK), may be placed functionally between the conventional Link Layer and the contactless Physical Layer.
“Some embodiments of the invention may include: a virtualized, contactless link-based Physical Layer, (VcPHY), which is adapted for implementing interface specifications and medium requirements for transmitting and receiving signals over an EHF Contactless Communications Link; a first, traditional, Standards-based Link Layer, (LINK) which directs a set of link training operation for the contactless line; a second Link Layer, (cLINK), in the VcPHY, that couples with the first Layer (LINK), and an EHF IC that can communicates over the contactless communications links
“The inventions described herein can relate to both industrial and commercial industries such as electronics, communications, and devices that communicate with other devices and devices that have communication between the components of the devices.”
“Other objects and features, as well as advantages, of the invention(s),” can be seen in the following illustrations and descriptions.
“Various embodiments (or examples), may be described in order to illustrate teachings about the invention(s). These descriptions should be taken as an illustrative and not as limiting. This description is not meant to limit the invention(s), but to illustrate certain embodiments. You should understand that different features from different embodiments can be combined with each other in various ways. Referring to “one embodiment”, “an embodiment”, or similar formulations may indicate that at least one embodiment contains a specific feature, structure, operation or characteristic.
“The embodiments and their aspects may be described and illustrated with systems, devices, and methods that are intended to be exemplary and ilustrative and not limitative in scope. Specific configurations and details can be provided to aid in understanding the invention. It should be obvious to anyone skilled in the arts that the invention(s), however, may be used without the details described herein. Some well-known components or steps may be described in a general manner, or omitted for illustrative purposes.
“The following descriptions may contain specific details to help you understand the inventions disclosed. These inventions may be used in a variety of ways, as should those who are skilled in the art. Headings (usually underlined) are provided to aid the reader and should not be considered as limiting.
“Contactless Connectivity”
A contactless connector, which may include an EHF IC/contactless subsystem, may be used to replace wired connections that have little to no interaction with the host system. An EHF IC can include a controller, one to three storage elements, as well as radio frequency circuitry that implements an EHF, EHF, RX, or EHFXCVR. Contactless connectors can be used to monitor, control, and direct (manage) link operations to dynamically adapt to conditions. They also allow for monitoring and altering (or modifying) data passed through them. Connectors can identify the content being transferred, provide authentication and security services, as well as enable application support for host systems based upon the type or content of the connection. The connectors can be used independently from the host systems.
“Gen I Contactless Connectivity
“FIG. “FIG. 1” illustrates a system architecture that may be representative for some Gen I contactless connectivity options. For illustration purposes, certain features that are specific to individual solutions may not be shown. You may also describe other features that are specific to a few solutions.
“A communication system 100 consists of two electronic devices 102 & 122 that may communicate with each other (using Standards-based protocol and/or signaling), over associated electrical links between the host systems, the EHF ICs and the EHF contactless transmission medium 150. In some cases, such as USB. one device may be called the ‘host’ and the other as the?device .
“Data can be transferred in at most one direction from a first device (102), which could be considered a?source? To send the data to be transmitted to a second device (122), which could be considered a ‘destination? to receive the data that has been transferred. The transfer of data between the first device (102) and the second device (122) will be described in the following. It is important to understand that data can alternatively or additionally transfer from the second device (acting as a source?). For sending the data), to the first device, 102 (acting in the?destination) to receive the data), and information can be exchanged in both directions between these two devices 102 (acting as a?destination?).
“The two devices 102 & 122 can be described as mirror images for illustrative purposes. Although they may appear identical, it is important to understand that the devices 102 and 122 could be completely different. One device could be a laptop computer and the other a mobile phone. The following electronic devices may be among the ones that may benefit from the disclosed techniques: cell phones, smartphones, computers, docks (docking station), tablets, laptops, and other similar electronic devices, just to name a few.
“The first electronic device 102 may be a Gen I device. It may include a host system 104 and a Gen I EHF IC 106.
“The EHF IC 106 might be capable of performing at most one of the following:
“The EHF IC 106 could contain some or all of these elements:
“The EHF PHY 108 may be a communication port/channel that is adapted to communicate via the particular PHY 114 and LINK 115 implemented in the host systems 104.”
“The connector 106 could also include control circuits or measurement circuits. These are omitted for illustrative purposes.”
“The host system 104 could include a PHY 114, which can, for example be configured to operate with a cabled connection such a USB, PCIee, DP, and so forth. A microprocessor 116 may be added to the host system 104. If the EHF IC 106 is not available, the host microprocessor 116 or microcontroller 116 may be used as the processor 110.
“The host system 104 could also include a Standards based LINK 115 that may be configured to operate with a Standards based protocol.
“The second electronic device 122 may be a Gen I device. It may be substantially the same as the first electronic device 102 in terms of EHF contactless operability.
“The EHF IC 126 could contain some or all of these elements:
“The host system 124 could include a PHY 134 that may be configured to operate with a cabled connection, such as USB, PCIee, DP, and so forth. A microprocessor 136 or microcontroller 136 may be added to the host system 124. If the EHF IC 106 is not available, the host microprocessor 136 or microcontroller 136 may be used as the processor 130.
“The EHF IC 126’s EHF-PHY 128 may contain a communication port/channel that can be used to communicate with host system 124 via the specific PHY 134 (or LINK 135) which is implemented in host system 124.”
“The host system 124 could also include a LINK 135 that may be configured to operate with a Standards-based Protocol, for instance.”
The EHF ICs 106 & 126 may function without any intervention from the host or its processors 116 & 136 and may provide control signals for the host system 104 et 124 or portions thereof. The host system might provide basic functions such as a power-on signal or indication to increase/decrease EHF power to EHF IC.
“The EHF ICs 106 & 126 can open/activate applications. They may also return status/power levels, data types, connection parameters, power levels, connection parameters. Information on connected devices/systems, content information, amount and type of data being transmitted, device configuration based upon connection type, link management, quota, channel control, etc.
“The dashed-line rectangles around the EHFICs 106 & 126 in the figure may be simply a symbol of?partitioning? of functions that separate (distinguishing the) EHF ICs and host systems 104 or 124. The symbolically shown antennae may be thought to be outside the dashed-line rectangles of the EHFICs 106 or 126. However, they may be placed either internally or externally to the EHFIC constituting the contactless system.
“The processors 110/130 and 116/136, may be embedded microprocessors, or microcontrollers, or state machines, may run a management operating system (OS) for the connection, and may have built-in authentication/encryption engines.”
“Signals between two electronic devices (102/122 and 202/222), 402/422, 402/422, 502/522, 502/522) can be implemented using an EHF contactless line (150, 250 or 350), which may include a medium such as an air gap, waveguide or plastics (polyethylene (thermoplastic polymers), polyvinylidene dimfluoride (fluoropolymers), ABS (and other plastics), and combinations of these plastics. Other dielectric materials, such as cardboard, can also pass the EHF signal. The EHF signal can pass through many different dielectric materials or waveguides.
“A single communication link can be made up of multiple (multiple) independent links that are associated with different data streams. As shown in FIG. 4. 6.”
“Exercises in contactless communication (EHF) allow large files such as movies, audio and device images to be transferred quickly. This is in contrast to other technologies like NFC. A 1 Gigabyte file can be transferred in 5 seconds.
“The electromagnetic communication can typically occur over an air gap, and may be limited in range to 0-5 cm. To extend the range of contactless communication between devices 102 and 122, a dielectric medium, such as a dielectric coupler, may be used.
“It is important to understand that this and other embodiments of contactless connections discussed herein allow for an overall communication system to be implemented using a combination or physical (wired), links. Some of the techniques described in this article can be used to transfer data over a physical link such as a cable or connectors. Some of the same techniques may also be used to transfer data via wireless links, such as Bluetooth or WiFi. The use of an EHF contactless connection to transfer data between two devices will be discussed in the main.
“An example of a data flow?” The following may be used as an example of a data flow: Data originating from host system 104 (or data originating in the first EHF IC 106) may be provided via the EHF-XCVR 112. onto the contactless line 150. The data is transmitted through the contactless link 150. The host system 124 may receive data from the contactless line 150 via the EHF-XCVR 132. This may allow the data to be passed on to the EHF IC 126. Data can flow in reverse, from host system 124 to the EHF IC 126 or originating at EHF IC 126, onto the contactless line 150 to the EHF IC 106. The data may be passed to host system 104 or it may remain in first EHF IC 106. These are the EHF ICs (106 and 126) described.
“The EHFXCVRs (112/132), 212/232 and 312/332, 512/532 and, as applicable, the EHF/TXs (411/431, 412/332 and 512/532), disclosed herein, may include any means for converting between electromagnetic (EM) signals, and communicating EHF signals contactlessly across an EHF transmission medium (150-250, 350, 450 and 550 between the first and second electronic devices (102/122; 202/222; 302/422, 402/422, 402/422, 2/422, 502/422, 2/422, 2/422, 2/422, 2/422, 2/422, 402/422, 2/422, 2/422, 2/422, 2/422, 2/422, 2/422, 2/422, 402/422, a 422, 502/422, 2/422, 2/422, &s of the EHF signals).
“Gen I Contactless Systems”
“Gen I contactless subsystems can include an EHFIC consisting of two or more transceivers. Two (or more) transceivers, or transmitters and receivers, can support a feedback loop and full duplex operation. They also allow for latency, changes and simultaneous establishment of a second communication link (such that the host system can be contacted). Each transceiver may be a half duplex transceiver that can asynchronously transform a baseband signal into an EHF carrier. This carrier can then be radiated from either an external or internal antenna. It can also receive and demodulate carrier signals and reproduce them. The EHF carrier can penetrate many commonly-used nonconductive materials such as glass, plastic, etc
“It is important to understand that only one-way communication may be required. For example, from the first device (102), 202, 302, 502) to second device (122, 222, 322, 522) the transmit functionality of transceiver (112), 212, 312,512 could be achieved by a transmitter, and the transceiver (122, 212, 312,512 could be replaced with 132). FIG. FIG. 4 illustrates that multiple data streams can be provided with an EHF IC (406 and 426) as well as a separate EHF TX (411/431), and EHF RX (413/433).
To reduce electromagnetic interference (EMI) and simplify FCC certification, transmit power and receive sensitivity of transceivers (or transmitters or receivers) described herein can be controlled. Contactless connectors might produce RF energy that is below the FCC requirements to transmit an identification code (ID) code or certificate. This would interrupt data flow during data transfer.
“The transceivers’ signals (or transmitters’) can be modulated in any way that conveys the data being transferred between devices. Some examples are provided herein. Modulation can be OOK (on/offkeying) or any other similar simple modulation techniques. One transceiver may encode and packetize signals and transmit them, while another transceiver can receive and unpacketize and decode them. Other suitable techniques or out-of-band signaling may be used to transmit information that is not directly related to data being transferred between two devices.
“The transceivers or individual transmitters/receivers that may be implemented as chips may be factory serialized so that chips and their transmissions can be?tagged? This may allow for later forensic analysis in digital rights management (DRM). ”
“Some of these features may be implemented in the Gen II device disclosed herein. One advantage to using contactless connectivity to establish contact between two electronic devices (typically one), is that existing systems can benefit from contactless connectivity without requiring any changes to their host system. The EHF IC can communicate with its host system via Standards-based interfaces. The Gen I contactless solutions might require all or part of the PHY in a host system, or EHF-PHY, to be Standards compliant. This method, although it is easy to implement, can be used in multiple systems. However, it may not work well for all systems. Gen I systems have the following key characteristics:
The following elements may be found in the electronic devices described herein: The following table lists elements of the EHFIC (106/126/206/226. 325, 306/326. 406/426. 506/526.) Above the dashed line (—-)., elements of the host system (106/126/206/226., 325., 306/326., 406/426., 506/526. Below the dashed line (—-). are elements of the host system (104/124/224, 202/224, 325, 306/326, 406/426, 506/526, 506/526, and 506/526). You may list the following elements.
“Gen II Contactless Connectivity
According to some embodiments, the data and control block (or functions such as measurement or control circuits) of an EHF IC may be separated from it (e.g. 106, 126) and all or part thereof may be integrated into a host system (e.g. 104/124) of a device (e.g. 102/122). This allows the EHF signaling section of the EHF IC to be simplified and focuses primarily on the analog or RF portions of contactless communication over the Contactless Link.
“As you will see from the examples and embodiments, the Gen II Contactless Connectors (or Gen II Contactless Subsystems/EHFICs) provide a high level of flexibility in the design of the contactless systems. The Gen II implementations could include certain features from the Gen I versions. One example is that the EHF IC might control one or more aspects the contactless or the electrical links. This may include some of the power management features, signal swings of electrical interface, and other parameters. However, the overall state of contactless or electrical links is controlled and managed largely by the host system.
“Information pertaining the contactless data or control portions can be exchanged via a Standards-based interface between the host system’s EHF IC and the host system. It may or not be visible to any software on the host system. This interface may be available by the host software on the device if it has a Gen II contactless connectivity connector.
“FIG. “FIG. Data can be transmitted in at least one direction. It could be sent from a first device, 202, for the sending of the data, and then to a second, 222, for the receiving of the data. The partner device can be the second device 222. The transfer of data between the first device (202) and the second device (222) will be described in the main. It should be noted that data can be transferred from the second device (222) to the first device (202) as a source or sink for the data. Information may also be exchanged between the devices 202 and 222. The EHF contactless link 250 between the devices 202 and222 is shown.
Summary for “Virtualized physical Layer adapted for EHF contactless communications”
It is important to “connect” electronic devices. “It is often important to “connect” electronic devices. This allows them to communicate with each other, transfer data, or just communicate between them. Exemplary data being transferred between devices may comprise a media file (such as an image file, an audio file, a video file), DRM (digital rights management) protected content, an OS (operating system) update, customer specific code, OEM (original equipment manufacturer) specific code, retail specific code, a firmware image for the destination device, user data, encryption/decryption keys (codes), electronic funds transfer (EFT) data, static data and the like.”
“In the description herein, one device participating in a communication link may be called a?source?” The sending (or sending) device is referred to as the?source?, while the other device can be called a ‘destination? Or a?sink?” (or receiving) device. These devices can also be called a “partner?” device. It is important to understand that data can be transferred between both devices in one or both directions.
“Some electronic devices that may benefit from the methods disclosed herein include, but not limited to, cell phones (or smart phones), computers and laptops, tablets, and other similar electronic devices.”
“Communications between two devices typically consist of a wired or cabled connection. A cabled connection, such as USB (Universal Serial Bus), is usually point-to-point and requires mechanical connectors at each end and a cable connecting the two devices (one device may be a hub?). Connecting point-to-point to several other USB-enabled gadgets. Wireless connections such as Bluetooth or WiFi operate in a more broadcast-like mode. Mode, in which one device can simultaneously communicate with multiple devices over a radio frequency link (typically between 700 MHz and 5.8 GHz).
“Mechanical connectors can only be used to connect, but they are passive and do not offer any additional capabilities or features. The connection will either be working or not. The terms “Host System” and “Host IC” are interchangeable. Alternatively,?Host IC’ or?Host System? are used interchangeably. Refers to any device, or part thereof, that can include an integrated circuit (or more) that implements functionality required to communicate with a connector. In setting up the communication link, the host system behind the connector may do some initial analysis, including detection and enumeration devices connected. This can be time-consuming and generally the link operates until it fails. A host system can be programmed to try to restore the link after it has failed. This can be cumbersome.
“Mechanical connectors are at risk for breakdown either due to wear and tear or due to the use of inappropriate force applied when inserting/de-inserting the connectors. Mechanical connectors are costly to make due to the risk of failure and the high cost of manufacturing them.
It is difficult to use multiple connectors to transfer different protocols data. Each protocol data transmission will require a different connector and cable. There is a limit to the length of the cable that can be used. Data transfer at multiple-Gbps over a long cable causes signal reliability issues at receivers. This could be compensated either at receiver or transmitter ends, but it increases power dissipation as well as system complexity.
“A wireless connection like Bluetooth or WiFi works in a more broadcast? Mode, in which one device can simultaneously communicate with multiple devices over a radio frequency link (typically between 700 MHz and 5.8 GHz).
“Point-to-point connections-oriented techniques for data transmission between two electronic devices are the focus of this article. Near Field Communication (NFC) is an example of a wireless connection-oriented point-to-point communications link that allows data transfer between electronic devices. NFC is a standard for smartphones and other similar devices that establish radio frequency communication (RF) with one another by touching (?bumping?) They can be brought together or brought into close proximity to one another.
“Terms and definitions”
“The following terms can be used in the descriptions herein:
The acronym “EHF” stands for Extremely High Frequency. “EHF” stands for Extremely High Frequency and refers to a part of the electromagnetic spectrum (EM) in the radio frequency range (30 GHz to 300 GHz (gigahertz).
“Electronic devices can be referred to as?devices’ in this document.
“?Host systems? Refers to integrated circuits capable of establishing, maintaining and/or terminating communications with other integrated circuits.
“Contactless” refers to the implementation of electromagnetic (EM) connections and transporting signals between entities (such devices). The term “wireless” is used in some literature. This term is used to express this meaning. The term “contactless” is used in this context. The term ‘contactless? may be used to refer to a carrier assisted, dielectric coupling device that may have an optimal range of zero to five cm (also known as?close proximity?). Contactless link is another term. A communication link that does not use a contactless method of communication is called a “contactless link”. A connection can be established by the proximity of one device and another device. Multiple receivers and transmitters can occupy small spaces. An electromagnetic link may only be used for contactless transmissions. A wireless connection, on the other hand, can send information to multiple points.
“Contactless connector” is a term that refers to a type of connector called. This refers to a group of connectors that include the contactless function. It may also include passive components, integrated circuits, shielding materials, structures, and any other components necessary to integrate the contactless connector into a device.
“Contactless subsystem” is a term that refers to a subsystem. A subsystem that can be integrated into a contactless connector. It may include integrated circuits that enable data transmission or receipt. They may also perform other functions such as power management, support active or passive circuitry and antenna or transducer. One part of the active circuitry can be implemented as an integrated circuit (also known as the?EHFIC?). This is part of the contactless system and may include transmitter(s), receivers, and interfaces with the contactless medium as well as an electrical interface.
The terms chip, die (or integrated circuit), semiconductor device, and microelectronic devices are all used interchangeably in common usage and may be used interchangeably in this document. These terms may also include packaged chips (or chips), bare chips (or chips), and chips modules and packages. The techniques disclosed herein may be implemented with integrated circuits (ICs) using standard CMOS (Complementary-Metal-Oxide-Semiconductor) processes. Some functions that are described as being implemented with chips can be implemented as macro-functions in application specific integrated circuits, ASICS, or the like. Or, alternatively, software running on a microcontroller may be used to implement at least some of these functions. With respect to chips, various signals may be coupled between them and other circuit elements via physical, electrically-conductive connections. This point of connection can be called an input, output (I/O), terminal or line, pin pad, port, interface or other similar variants.
“The term’microprocessor’ is used interchangeably with the term “microprocessor”. “The term?microprocessor?” (?P) or simply?processor? may be used to refer to either a microcontroller or microprocessor (?C). A microprocessor is an integrated circuit (IC) that only has the CPU (central processing units) inside. It does not have RAM, ROM or other peripherals. A microcontroller generally has a CPU and a fixed amount RAM (random access memory), read only memory (ROM) and other peripherals. These chips are typically used to perform specific tasks that have a defined relationship between input and output. The input usually requires some processing before the output can be delivered.
“The term “adapted” may be used to mean that the referenced device, IC or part of an IC, or a functional block is either designed, dedicated. “Adapted” could be used to indicate that the referenced device or part of an IC or a functional bloc is either designed, dedicated or arranged to meet a specific requirement.
“?Standards? “?Standards?” and similar terms like?Standards based?, interfaces based on standards?, protocol based on standards?. The term “wired interface standards” may also be used to refer to the following: USB, DisplayPort, Thunderbolt (DP), HDMI, SATA/SAS (PSA), Thunderbolt), HDMI, SATA/SAS/AS, PCIe and Ethernet SGMIII. Quickpath, I2S and GPIO as well as their extensions and revisions.
“The Physical Layer (??PHY?)”
The Physical Layer (PHY), which provides an electrical interface to a transmission medium, defines physical characteristics like connections, voltage levels, timing and the means of transmitting raw bit rather than logical data packets via a physical link. A bit stream can be broken down into code words and symbols, which are then converted into a physical signal to be transmitted over a transmission medium. The reference to PHY could also refer to its implementation in a semiconductor device.
“A Standards-based PHY includes the PHY specifications from one or more Standards.”
“Examples of notations are:
“The Data Link Layer (??LINK?)”
“The Data Link Layer may encode bits into packets before transmission and then decode the packets back into bits at destination. It may provide reliable data transfer by transmitting the required synchronization error control and flow control. The LINK can be sub-layered, including the media access control sublayer (MAC) and the logical control sublayer (LLC).
“It should be understood that a reference LINK could refer to one or more functionalities that the LINK might be incorporated into a system in a particular layered stack configuration, as defined by the respective standards or proprietary protocols.”
“A Standards-based LINK includes the LINK functions from one or more Standards.”
“A contactless LINK?cLINK?” A LINK is a link that allows communication between a host system (?cLINK?) and an EHF IC. This allows the host system to and/or EHF IC both to optimize the contactless and electrical links.
“Term?transmitter” “The term?transmitter” can be abbreviated as?TX). could refer to a device, or an IC, that can be used to transmit data (information). The term “receiver” is sometimes abbreviated as?RX? The term?receiver? (also known as?RX?) may be abbreviated. could refer to a device (or an IC) that can be used to receive data (data). The term “transceiver” is used. The term?transceiver’ can be abbreviated as?XCVR? may refer to a device, or an IC, that includes a TX and a RX portions, often sharing some circuitry, so that the IC can be used to transmit and/or receive data. A transceiver (XCVR), in general, can be used in either a half-duplex (alternating between transmitting/receiving) or full-duplex (transmitting/receiving simultaneously). It may also be configured as either a transmitter (simplex mode) or as a receiver (simplex). Separate TXs or RXs can be used in some embodiments instead of XCVRs. When the term?XCVR? is used, it should be understood to include separate RXs and TXs. If transceivers, transmitters, or receivers are referred to in the plural, then the singular form of TX, RX, or XCVR may be used instead of XCVRs TXs, or RXs. Prefixes used with terms?XCVR,??TX,???RX? refer to the specific communication medium with which they interface and the device or IC in which they reside.
“An example list includes:”
“Generation I (Gen I?) Contactless Subsystem
“In a Gen I Contactless Subsystem, a significant part of control and management for the contactless link is done in the EHF IC and a substantial portion of control and management for the electrical link are performed in host system. An EHF IC can also be designed to comply with any of the Standards that are applicable to its interface with the host. An EHF IC-based contactless system or device that includes an EHF IC may be referred as a Gen I device.
“Generation II (Gen II) Contactless Subsystem
“In a Gen II Contactless Subsystem, a significant part of control and management for the contactless link or the electrical link is done in the host system. Both the EHF IC or the host system can be designed to maximize performance on both contactless and electric links. Gen II devices may include an EHF IC, contactless subsystem or device that is based on a Gen II subsystem.
“Serializer/Deserializer (?SERDES?)”
“Part of PHY that implements one or both of the serializer and deserializer functions(s).
“It is the general object of the invention that improved communication techniques between electronic devices be provided, which may include some techniques to incorporate EHF contactless communication capability into the device, such as by changing the PHY or the LINK of the host system.
These and other objects can be accomplished by removing mechanical connectors and wires and using contactless connectors and an electromagnetic communications link. A contactless subsystem that is associated with a device’s host system may include at least one EHFXCVR, separate EHFXTX and EHFX-RX, as well as associated transducers and antennas for converting between electrical and EM signals.
“Accordingly to some embodiments, the invention described herein, a given electronic gadget may comprise a contactless system and a host-system having a Standards based PHY.”
“Accordingly to some embodiments, the invention disclosed herein, a given electronic gadget may be based upon a Gen II contactless system interfacing with a Host System.”
“Accordingly to some embodiments, the host system may include Standards-based interfaces. It may also contain a Standards-based LINK such as a LINK that is compatible with the DisplayPort protocol (DP). A SERDES may also be part of the host system. One or more EHF ICs may be included in the EHF IC, or alternatively one or two EHF TXs or EHF RXs.
According to certain embodiments of the invention, the data and control block (or functions such as measurement or control circuits) may be separated from the EHF IC and integrated into the host system. This allows the EHF signaling section of an EHF IC to be simplified and integrated into an EHF IC that focuses primarily on the analog or RF portion of contactless communication over the callless link.
“Accordingly to some embodiments disclosed herein, the PHY within an electronic device’s host system may be replaced or modified or augmented with a Host cPHY that is able to use EHF contactless communications and the operation EHF EHF ICs. The Host cPHY can translate logical communication requests from the LINK to hardware-specific operations that influence (implemente, control, manage, and manage) the transmission or reception signals over the EHF Contactless Link. An EHF-cPHY within the EHF IC can handle signals between the Host-cPHY or PHY in a host-system of the device and EHF IC. The LINK in a host system of the device could also be optimized to allow for EHF contactless communications. The signaling between the Host cPHY and EHF IC can be done using either analog or digital signaling or both. It is possible to use Gen II devices with a Host cPHY and Gen I devices with a Standards-based HY. Multiple data streams can be transmitted over the contactless link at different frequencies.
According to certain embodiments of the invention (or simply?VcPHY), a virtualized contactless physical layer (?VcPHY?) is generally used. A Host-cPHY is an arrangement (adaptation, implementation, configuration, defined, and possibly combined with the cLINK) that allows seamless communication between devices. VcPHY is an interface that can be used to electrically connect with an EHF IC capable of contactless communication. The EHC IC can communicate with an EHF IC or with a contactless connector using an EHF contactless connection.
A VcPHY can contain a Host cPHY that has some of the LINK or the cLINK functionality. The VcPHY may include LINK functionality that functions to connect a Standards-based link with the Host cPHY. The resulting VcPHY could have LINK functionality directed at the contactless link. It may also have PHY functionality directed towards the electrical connection between host system and EHF IC. The VcPHY can manage the contactless connection to perform functions based upon the protocol data to be sent over the contactless line and the environment in which it is being implemented.
Contactless communication may allow data transfers at multiGbps rates comparable to traditional wireline communications. However, contactless communication has some fundamental advantages. These include the absence of mechanical connectors, the associated benefits in terms of cost reliability, cost, ease of use, power dissipation and silicon footprint. Many of these benefits may be possible with the Host-cPHY or the cLINK. VcPHY can further enhance the use of contactless connectors. It simplifies the integration of EHF ICs in host systems and devices. This allows for greater flexibility in transmitting a variety protocol data over the contactless link while requiring minimal protocol-related operations. Some embodiments make use of the processing power of a host system, which may include a processor/a controller to direct or control the EHF IC’s functionality. This may improve the overall power dissipation of the system and the silicon footprint. The EHF IC’s implementation can be made simpler by allowing the host system to play a greater role in contactless communication. The EHF IC might primarily have analog blocks, which are mainly directed at maintaining EHF signaling over the contactless link. This makes the EHF IC easier to implement and can simplify any logical or processing operations required in the EHF IC.
According to certain embodiments of the invention, an electronic system may include: a host (Host IC), operating with an Open Systems Interconnection network architecture consisting of a Physical Layer and a first Standards based Link Layer. A contactless Physical Layer is used to transmit and receive signals over the EHF Contactless Link via the EHF IC. The second Link Layer (cLINK), may contain functionality directed at the contactless link. The functionality of the second Link Layer (cLINK), may be directed at the electrical connection between host system and EHF IC. The second Link Layer (cLINK), may be used to allow the first Link Layer to communicate with the virtualized, contactless PHY (VcPHY). This is similar to the VcPHY being a Physical Layer implementation according to a specific Standards’ specification. Display Port, HDMI and PCIe are all possible options. Each of the first and second Link Layers could share at least one function. The second Link Layer (cLINK), may be capable of performing at least one function that is directed towards the enabling and maintaining contactless links. The second Link Layer (cLINK), may be able to perform at most one of beaconing, polling, and security verification functions. The first conventional Link Layer may be able to listen for EHF contactless links or perform beaconing. It may also be able to set the link parameters of at most a segment of path that couples the first traditional Link Layer and the contactless EHFIC. The second Link Layer, cLINK, may be able to set the parameters for at least one segment of the path that links the second Link Layer cLINK and the contactless EHFIC IC. The second Link Layer (cLINK), may be able to set parameters for the contactless link. The first link training operation for the contactless line may be directed by the first conventional Link Layer (LINK). An electronic device can include a plurality LINKs, a plurality VcPHYs, and a plurality at least one transceiver (EHFXCVR). A plurality of LINKs may be included in the electronic device. One VcPHY can also be used. In this case, a particular LINK is connected selectively to the single VcPHY at a time. Multiple LINKs, multiple VcPHYs, and a switch routing data stream between the multiple links and multiple VcPHYs may be included in the electronic device. Multiple EHF ICs may be included in the electronic device. One or more LINKs, an associated EHF IC, an Ethernet protocol stack and an EHF IC may make up the electronic device. Two EHF ICs, a host system with a first VcPHY and a second host systems with a second VcPHY may be part of the other electronic device. The electronic device can include at least two VcPHYs, and at least two EHFICs. Additionally, the other electronic device could contain a network processor. The electronic device can contain at least two VcPHYs with at least two EHFICs. Another electronic device could include a bridge chip.
According to certain embodiments of the invention, a method for communicating between electronic devices using an EHF Contactless Communications Link, at least one electronic device with a host system and EHF IC (EHF IC) may be described as: providing at minimum one electronic device with a virtualized physical layer (VcPHY), which is dedicated to EHF direct communication over the EHF contactsless communications link. The virtualized physical layer-based contactless physical layer (VcPHY), may include a contactless Physical Layer, (Host cPHY), which can be used to implement interface specifications and medium needs for sending and receiving signals over EHF contactless communications links. A virtualized virtualless link based Physical Layer(VcPHY), may also contain a contactless Link Layer (cLINK), which may functionally link a conventional Link Layer or LINK with the virtualized virtual contactless linked-based Physical Layer. The contactless Link Layer, (cLINK), may be directed at the contactless link or (ii) function directed towards the electrical connection between host system and EHF IC. To isolate the Link Layer from the EHF contactless communications, the contactless link layer (cLINK), may be placed functionally between the conventional Link Layer and the contactless Physical Layer.
“Some embodiments of the invention may include: a virtualized, contactless link-based Physical Layer, (VcPHY), which is adapted for implementing interface specifications and medium requirements for transmitting and receiving signals over an EHF Contactless Communications Link; a first, traditional, Standards-based Link Layer, (LINK) which directs a set of link training operation for the contactless line; a second Link Layer, (cLINK), in the VcPHY, that couples with the first Layer (LINK), and an EHF IC that can communicates over the contactless communications links
“The inventions described herein can relate to both industrial and commercial industries such as electronics, communications, and devices that communicate with other devices and devices that have communication between the components of the devices.”
“Other objects and features, as well as advantages, of the invention(s),” can be seen in the following illustrations and descriptions.
“Various embodiments (or examples), may be described in order to illustrate teachings about the invention(s). These descriptions should be taken as an illustrative and not as limiting. This description is not meant to limit the invention(s), but to illustrate certain embodiments. You should understand that different features from different embodiments can be combined with each other in various ways. Referring to “one embodiment”, “an embodiment”, or similar formulations may indicate that at least one embodiment contains a specific feature, structure, operation or characteristic.
“The embodiments and their aspects may be described and illustrated with systems, devices, and methods that are intended to be exemplary and ilustrative and not limitative in scope. Specific configurations and details can be provided to aid in understanding the invention. It should be obvious to anyone skilled in the arts that the invention(s), however, may be used without the details described herein. Some well-known components or steps may be described in a general manner, or omitted for illustrative purposes.
“The following descriptions may contain specific details to help you understand the inventions disclosed. These inventions may be used in a variety of ways, as should those who are skilled in the art. Headings (usually underlined) are provided to aid the reader and should not be considered as limiting.
“Contactless Connectivity”
A contactless connector, which may include an EHF IC/contactless subsystem, may be used to replace wired connections that have little to no interaction with the host system. An EHF IC can include a controller, one to three storage elements, as well as radio frequency circuitry that implements an EHF, EHF, RX, or EHFXCVR. Contactless connectors can be used to monitor, control, and direct (manage) link operations to dynamically adapt to conditions. They also allow for monitoring and altering (or modifying) data passed through them. Connectors can identify the content being transferred, provide authentication and security services, as well as enable application support for host systems based upon the type or content of the connection. The connectors can be used independently from the host systems.
“Gen I Contactless Connectivity
“FIG. “FIG. 1” illustrates a system architecture that may be representative for some Gen I contactless connectivity options. For illustration purposes, certain features that are specific to individual solutions may not be shown. You may also describe other features that are specific to a few solutions.
“A communication system 100 consists of two electronic devices 102 & 122 that may communicate with each other (using Standards-based protocol and/or signaling), over associated electrical links between the host systems, the EHF ICs and the EHF contactless transmission medium 150. In some cases, such as USB. one device may be called the ‘host’ and the other as the?device .
“Data can be transferred in at most one direction from a first device (102), which could be considered a?source? To send the data to be transmitted to a second device (122), which could be considered a ‘destination? to receive the data that has been transferred. The transfer of data between the first device (102) and the second device (122) will be described in the following. It is important to understand that data can alternatively or additionally transfer from the second device (acting as a source?). For sending the data), to the first device, 102 (acting in the?destination) to receive the data), and information can be exchanged in both directions between these two devices 102 (acting as a?destination?).
“The two devices 102 & 122 can be described as mirror images for illustrative purposes. Although they may appear identical, it is important to understand that the devices 102 and 122 could be completely different. One device could be a laptop computer and the other a mobile phone. The following electronic devices may be among the ones that may benefit from the disclosed techniques: cell phones, smartphones, computers, docks (docking station), tablets, laptops, and other similar electronic devices, just to name a few.
“The first electronic device 102 may be a Gen I device. It may include a host system 104 and a Gen I EHF IC 106.
“The EHF IC 106 might be capable of performing at most one of the following:
“The EHF IC 106 could contain some or all of these elements:
“The EHF PHY 108 may be a communication port/channel that is adapted to communicate via the particular PHY 114 and LINK 115 implemented in the host systems 104.”
“The connector 106 could also include control circuits or measurement circuits. These are omitted for illustrative purposes.”
“The host system 104 could include a PHY 114, which can, for example be configured to operate with a cabled connection such a USB, PCIee, DP, and so forth. A microprocessor 116 may be added to the host system 104. If the EHF IC 106 is not available, the host microprocessor 116 or microcontroller 116 may be used as the processor 110.
“The host system 104 could also include a Standards based LINK 115 that may be configured to operate with a Standards based protocol.
“The second electronic device 122 may be a Gen I device. It may be substantially the same as the first electronic device 102 in terms of EHF contactless operability.
“The EHF IC 126 could contain some or all of these elements:
“The host system 124 could include a PHY 134 that may be configured to operate with a cabled connection, such as USB, PCIee, DP, and so forth. A microprocessor 136 or microcontroller 136 may be added to the host system 124. If the EHF IC 106 is not available, the host microprocessor 136 or microcontroller 136 may be used as the processor 130.
“The EHF IC 126’s EHF-PHY 128 may contain a communication port/channel that can be used to communicate with host system 124 via the specific PHY 134 (or LINK 135) which is implemented in host system 124.”
“The host system 124 could also include a LINK 135 that may be configured to operate with a Standards-based Protocol, for instance.”
The EHF ICs 106 & 126 may function without any intervention from the host or its processors 116 & 136 and may provide control signals for the host system 104 et 124 or portions thereof. The host system might provide basic functions such as a power-on signal or indication to increase/decrease EHF power to EHF IC.
“The EHF ICs 106 & 126 can open/activate applications. They may also return status/power levels, data types, connection parameters, power levels, connection parameters. Information on connected devices/systems, content information, amount and type of data being transmitted, device configuration based upon connection type, link management, quota, channel control, etc.
“The dashed-line rectangles around the EHFICs 106 & 126 in the figure may be simply a symbol of?partitioning? of functions that separate (distinguishing the) EHF ICs and host systems 104 or 124. The symbolically shown antennae may be thought to be outside the dashed-line rectangles of the EHFICs 106 or 126. However, they may be placed either internally or externally to the EHFIC constituting the contactless system.
“The processors 110/130 and 116/136, may be embedded microprocessors, or microcontrollers, or state machines, may run a management operating system (OS) for the connection, and may have built-in authentication/encryption engines.”
“Signals between two electronic devices (102/122 and 202/222), 402/422, 402/422, 502/522, 502/522) can be implemented using an EHF contactless line (150, 250 or 350), which may include a medium such as an air gap, waveguide or plastics (polyethylene (thermoplastic polymers), polyvinylidene dimfluoride (fluoropolymers), ABS (and other plastics), and combinations of these plastics. Other dielectric materials, such as cardboard, can also pass the EHF signal. The EHF signal can pass through many different dielectric materials or waveguides.
“A single communication link can be made up of multiple (multiple) independent links that are associated with different data streams. As shown in FIG. 4. 6.”
“Exercises in contactless communication (EHF) allow large files such as movies, audio and device images to be transferred quickly. This is in contrast to other technologies like NFC. A 1 Gigabyte file can be transferred in 5 seconds.
“The electromagnetic communication can typically occur over an air gap, and may be limited in range to 0-5 cm. To extend the range of contactless communication between devices 102 and 122, a dielectric medium, such as a dielectric coupler, may be used.
“It is important to understand that this and other embodiments of contactless connections discussed herein allow for an overall communication system to be implemented using a combination or physical (wired), links. Some of the techniques described in this article can be used to transfer data over a physical link such as a cable or connectors. Some of the same techniques may also be used to transfer data via wireless links, such as Bluetooth or WiFi. The use of an EHF contactless connection to transfer data between two devices will be discussed in the main.
“An example of a data flow?” The following may be used as an example of a data flow: Data originating from host system 104 (or data originating in the first EHF IC 106) may be provided via the EHF-XCVR 112. onto the contactless line 150. The data is transmitted through the contactless link 150. The host system 124 may receive data from the contactless line 150 via the EHF-XCVR 132. This may allow the data to be passed on to the EHF IC 126. Data can flow in reverse, from host system 124 to the EHF IC 126 or originating at EHF IC 126, onto the contactless line 150 to the EHF IC 106. The data may be passed to host system 104 or it may remain in first EHF IC 106. These are the EHF ICs (106 and 126) described.
“The EHFXCVRs (112/132), 212/232 and 312/332, 512/532 and, as applicable, the EHF/TXs (411/431, 412/332 and 512/532), disclosed herein, may include any means for converting between electromagnetic (EM) signals, and communicating EHF signals contactlessly across an EHF transmission medium (150-250, 350, 450 and 550 between the first and second electronic devices (102/122; 202/222; 302/422, 402/422, 402/422, 2/422, 502/422, 2/422, 2/422, 2/422, 2/422, 2/422, 402/422, 2/422, 2/422, 2/422, 2/422, 2/422, 2/422, 2/422, 402/422, a 422, 502/422, 2/422, 2/422, &s of the EHF signals).
“Gen I Contactless Systems”
“Gen I contactless subsystems can include an EHFIC consisting of two or more transceivers. Two (or more) transceivers, or transmitters and receivers, can support a feedback loop and full duplex operation. They also allow for latency, changes and simultaneous establishment of a second communication link (such that the host system can be contacted). Each transceiver may be a half duplex transceiver that can asynchronously transform a baseband signal into an EHF carrier. This carrier can then be radiated from either an external or internal antenna. It can also receive and demodulate carrier signals and reproduce them. The EHF carrier can penetrate many commonly-used nonconductive materials such as glass, plastic, etc
“It is important to understand that only one-way communication may be required. For example, from the first device (102), 202, 302, 502) to second device (122, 222, 322, 522) the transmit functionality of transceiver (112), 212, 312,512 could be achieved by a transmitter, and the transceiver (122, 212, 312,512 could be replaced with 132). FIG. FIG. 4 illustrates that multiple data streams can be provided with an EHF IC (406 and 426) as well as a separate EHF TX (411/431), and EHF RX (413/433).
To reduce electromagnetic interference (EMI) and simplify FCC certification, transmit power and receive sensitivity of transceivers (or transmitters or receivers) described herein can be controlled. Contactless connectors might produce RF energy that is below the FCC requirements to transmit an identification code (ID) code or certificate. This would interrupt data flow during data transfer.
“The transceivers’ signals (or transmitters’) can be modulated in any way that conveys the data being transferred between devices. Some examples are provided herein. Modulation can be OOK (on/offkeying) or any other similar simple modulation techniques. One transceiver may encode and packetize signals and transmit them, while another transceiver can receive and unpacketize and decode them. Other suitable techniques or out-of-band signaling may be used to transmit information that is not directly related to data being transferred between two devices.
“The transceivers or individual transmitters/receivers that may be implemented as chips may be factory serialized so that chips and their transmissions can be?tagged? This may allow for later forensic analysis in digital rights management (DRM). ”
“Some of these features may be implemented in the Gen II device disclosed herein. One advantage to using contactless connectivity to establish contact between two electronic devices (typically one), is that existing systems can benefit from contactless connectivity without requiring any changes to their host system. The EHF IC can communicate with its host system via Standards-based interfaces. The Gen I contactless solutions might require all or part of the PHY in a host system, or EHF-PHY, to be Standards compliant. This method, although it is easy to implement, can be used in multiple systems. However, it may not work well for all systems. Gen I systems have the following key characteristics:
The following elements may be found in the electronic devices described herein: The following table lists elements of the EHFIC (106/126/206/226. 325, 306/326. 406/426. 506/526.) Above the dashed line (—-)., elements of the host system (106/126/206/226., 325., 306/326., 406/426., 506/526. Below the dashed line (—-). are elements of the host system (104/124/224, 202/224, 325, 306/326, 406/426, 506/526, 506/526, and 506/526). You may list the following elements.
“Gen II Contactless Connectivity
According to some embodiments, the data and control block (or functions such as measurement or control circuits) of an EHF IC may be separated from it (e.g. 106, 126) and all or part thereof may be integrated into a host system (e.g. 104/124) of a device (e.g. 102/122). This allows the EHF signaling section of the EHF IC to be simplified and focuses primarily on the analog or RF portions of contactless communication over the Contactless Link.
“As you will see from the examples and embodiments, the Gen II Contactless Connectors (or Gen II Contactless Subsystems/EHFICs) provide a high level of flexibility in the design of the contactless systems. The Gen II implementations could include certain features from the Gen I versions. One example is that the EHF IC might control one or more aspects the contactless or the electrical links. This may include some of the power management features, signal swings of electrical interface, and other parameters. However, the overall state of contactless or electrical links is controlled and managed largely by the host system.
“Information pertaining the contactless data or control portions can be exchanged via a Standards-based interface between the host system’s EHF IC and the host system. It may or not be visible to any software on the host system. This interface may be available by the host software on the device if it has a Gen II contactless connectivity connector.
“FIG. “FIG. Data can be transmitted in at least one direction. It could be sent from a first device, 202, for the sending of the data, and then to a second, 222, for the receiving of the data. The partner device can be the second device 222. The transfer of data between the first device (202) and the second device (222) will be described in the main. It should be noted that data can be transferred from the second device (222) to the first device (202) as a source or sink for the data. Information may also be exchanged between the devices 202 and 222. The EHF contactless link 250 between the devices 202 and222 is shown.
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