QUALCOMM Incorporated (San Diego, CA)

A device that includes a substrate including a plurality of metal layers, and dielectric layers. The first passive component is also included in the device. It has a first terminal and a second terminal. The first terminal is connected to a ground signal that is first received while the second terminal is linked to another ground signal so that the first passive component is shorted.

Field

Devices that include an underlying substrate and a passive surface that is mounted to it have various features.

Background

Surface mount technology (SMT) is a technology that allows components to be installed or placed directly on a surface of a printed circuit board or package substrate. Surface mounting of passive components, like resistors and capacitors, can be done to package substrates that are used for radio frequency applications (RF) and voltage regulation and other purposes.

It is important to develop smaller devices that have efficient design structures that are cost-effective in order to solve problems such as electromagnetic interference, heat loss, and effective inductance tuning.

Devices that have an underlying substrate and a surface mount passive part that is mounted to it have various features.

The first example shows the substrate that is made up of a variety of metal layers and a plurality dielectric layers. A first passive component is also part of the device. It comprises a primary terminal as well as a second. Furthermore the body that is first fixed to the substrate using one of the metal layers. The first terminal is connected to a first ground signal while the second terminal is linked to a second ground signal such that the first passive component is cut off.

The second example demonstrates a method for fabricating a packaged passive component. It includes the provision of the substrate with a number of metal layers and a plurality dielectric layers. The method further involves attaching a first passive component to the substrate on one of the plurality of metal layers, the first passive comprising one terminal, a second, and a first body, and coupling the first terminal with the first ground signal as well as the second terminal to a ground signal in a manner that the first component is cut off.

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