SAMSUNG ELECTRONICS CO., LTD. (Suwon-si, KR)
What is a Patent for Semiconductor package having stiffener
Search Patent for Semiconductor package having stiffener
1. Field
This disclosure is about a package of semiconductors with a stiffener.
2. Description of Related Art
With the trend of miniaturization of semiconductor devices, many semiconductor chips and other devices may be mounted in a single package. Because of the different the thermal expansion coefficient of different components of an asemiconductor package the semiconductor package can be distorted. Thus, there is an urgent need for technology to assist in the control of warpage of the semiconductor package.
One of the embodiments of the disclosure shows a semiconductor package with stiffener.
An example embodiment of the disclosure is a semiconductor package that includes a substrate with an upper surface and sides, an adhesive layer on the edge of the substrate, and an astiffener that comprises a horizontal portion on the adhesive layer, which extends from the horizontal to the external the substrate in a plan, and a vertical part that connects to the horizontal section , and expanding vertically downwards in the horizontal portion. The vertical portion could be separated from the side surface of the substrate, with the vertical gap being extending in a vertical direction therebetween and the size of the stiffener could be at least 40 millimeters.
A semiconductor package according to with an example embodiment of the disclosure could include a substrate including an upper and side surface, a one adhesive layer disposed on the upper portion of the substrate. It also includes a stiffener called a first placed on the adhesive layer and second stiffeners that are connected to the first stiffener, placed outside the substrate, in a plan-view and extending vertically, and second layers of adhesive disposed between the stiffener that is first and the second stiffeners. One portion of each second stiffener may be spaced from the substrate’s side by a vertical gap. The width outside of each second stiffener could be greater than 40 millimeters.
An example of the disclosure is a semiconductor package that includes a substrate with an upper and sides, an adhesive layer on opposite edges of each top surface of the substrate, and a stiffener with a horizontal section positioned upon the adhesive layer, and extending horizontally from the outside of the substrate in a plan view and a vertical part that is attached to the horizontal section and running vertically downwards along with a stiffener as well as heat sink attached to the heat spreader. The outer width of thestiffener can be as high as 40 mm.
Click here to view the patent on USPTO website.
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