Industrial Products – Alfred E. Brown, JR., Chevron Phillips Chemical Co LP
Abstract for “Phonon generation from bulk material for manufacturing”
“Disclosed embodiments involve the formation an article of manufacturing by using vibrations generated in bulk materials within a chamber. The vibrations are concentrated within a specific section of the base materials, and the focus is controlled so that the section undergoes a physical transformation to form at most a portion of an article of manufacture.
Background for “Phonon generation from bulk material for manufacturing”
“The present techniques pertain to the field methods of producing articles of manufacture such as additive manufacturing.”
This section is designed to introduce the reader, in a brief manner, to the various aspects of art that might be connected to the present disclosure. These aspects are described and/or claimed below. This discussion will provide background information that can help the reader better understand the various aspects of this disclosure. These statements should not be interpreted as prior art admissions.
Many of the goods and products we use today, simple or complex, were made from basic materials like metals, polymers, ceramics and metals. These materials are also used in certain advanced materials that have been developed by cutting-edge research. There are many ways you can use these materials to make useful products. Polyolefins are a broad class of polymers that can be used to make useful items. They can be used as retail and pharmaceutical packaging, as well as food and beverage packaging, such as bottles and juice bottles.
“Another example is ceramics or metals that can be brazed and drawn, melted and pressed, soldered and sintered, welded and so forth using certain specialized equipment to create different types of ceramic or metallic items. These ceramic and metallic items can be simple as floor tiles, conductive wires, or more complex articles like semiconductor devices.
“In these examples, consumer products are manufactured on an industrial scale using manufacturing equipment that can mass produce them. A mold can be filled with molten plastic to make cups. A blow molding device can be used for bottles. And, wire may be drawn using molten and softened metals by specific types of dies. The capital required to manufacture these articles of manufacturing on a large scale is often very high due to the cost of specialized equipment. The cost of producing articles of manufacturing does not stop at the production line. These articles need to be packed and shipped to customers. Customers may either use them as-is or subject them to further manufacturing.
In settings where mass production is not an issue, some equipment may use one or more of the materials mentioned above to make specific items such as prototypes. For example, some manufacturing systems might produce these items by depositing a manufacturing substance on a substrate and causing it to mix with the substrate layer-by-layer. The substrate can be different from the manufacturing material. This process can be compared to printing. A device may be used in the same way as a printer head, by simultaneously delivering small amounts of material onto a substrate and causing the substrate to mix with the material by providing enough energy to the material to cause it melt, react or any other similar effect. These techniques are often referred to as “3D printing.”
Although 3D printing is capable of creating three-dimensional structures, it can take many hours to complete. The print head must print every layer of the article using a repeating process. Each layer is printed on top and then the next layer, depending on how many layers are being printed. While these techniques are capable of creating unique items, they don’t usually have the ability to meet the demands of setting up production times that exceed a few hours. 3D printing has not been accepted as a commercially viable method of producing consumer goods due to its low throughput.
“Considering the limitations of current manufacturing methods, it is now acknowledged that it might be desirable to design systems capable of producing different types and in a faster manner. It is possible to design individual articles of manufacture in a manner similar to 3D printing, while still forming them at the same speed as commercially-produced manufacturing devices.
Below are descriptions of one or more embodiments of the disclosure. The specification does not cover all aspects of the actual implementation. This is to make it easier for readers to understand. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. It should also be noted that although such a development effort may be time-consuming and complex, it would still be routine design, fabrication, or manufacture for people of average skill who have the benefit of this disclosure.
“The terminology used in this document is intended for the description of particular embodiments and is not meant to limit examples. The singular forms?a,?an, and?the? are used herein. The singular forms?a?,?an???? and?the?? are intended to include the plural forms. Unless the context indicates otherwise, the plural forms are to be used. The terms “comprises”,? ?comprising,? ?includes? and/or ?including,? When used herein, these words indicate the presence of the stated features, integers and steps, operations and elements and/or their components. However, they do not preclude the addition or presence of other features, integers and steps, elements, or components.
Traditional manufacturing methods must balance design flexibility and production throughput, as stated above. Commercial production facilities can produce large quantities of a specific article of manufacture in relatively short time frames, but the equipment required for this high throughput is expensive and difficult to replace. This means that equipment at a specific site is used to produce specific products with very little variability. Many commercial production facilities have a low tolerance for variability.
On the other hand, manufacturing systems that allow for greater flexibility in product design such as additive manufacturing systems must balance this flexibility with high throughput. For example, additive manufacturing systems produce articles of manufacture by printing each layer using a printhead. This may deliver the base material as well as certain types or emissions (e.g. infrasonic. sonic. ultrasonic. hypersonic. optical. electron beam. heat) to the deposited layers to allow them to bond with an underlying substrate. This results in articles of manufacture that take longer to produce than is commercially possible, except for very special items (e.g. cost).
The present disclosure addresses these drawbacks and others of traditional manufacturing systems by using specific types of sound, heat, and light emission to?write?” An article of manufacture is transformed into a bulk substrate. This could be a bed of grains or another collection of material. Excitations can be generated in bulk substrates by using sound, light and/or heat emission. The excitations are directed to specific geometries within bulk substrates so that the article of manufacture is formed entirely or partially.
“Specifically, the present embodiments address manufacturing systems and methods that use projected emissions to form articles in place. This is in contrast to traditional manufacturing techniques which require layer-by-layer printing. In one embodiment of the disclosure, certain types of emissions may be directed at a solid material to generate vibration and heat. Emissions that are specifically tuned to a particular solid material may cause vibration or heating. The emissions interact with the solid materials to generate phonons within individual granules. Phonon propagation can also be observed between granules in some embodiments. The emission may be directed in one or more directions towards the solid material. It may be optical, acoustic, or any combination of both. Certain embodiments using acoustic emission may use the mechanical wave properties to generate localized pressures and/or heating in order to create specific areas of an article of manufacturing. Acoustic and optical emissions, as well as similar ones, may be used in further embodiments to generate phonon generation, propagation, and optical phonon generation. Certain emissions can be controlled to cause portions of bulk materials to resonate at frequencies sufficient to trigger a transformation that results in an article of manufacture. (e.g. by controlling phonon propagation and/or generation).
“Another aspect of the disclosure is that embodiments of a manufacturing process may use interfering optical emission to provide enough energy to bulk substrates to induce certain optically-initiated chemical reaction such as curing, polymerization or the like. These embodiments can be used in conjunction with other methods, such as those that use acoustic emission.
“A further aspect of this disclosure is that embodiments of the manufacturing process may use a metamaterial to act as an optical and/or acoustic waveguide. This allows for specific areas (e.g. focal regions) of bulk substrates to be addressed individually (e.g. selectively excited). Directed excitation can allow all or part of an article to be written into the bulk substrat. Metamaterials can be acoustic, acting as a phononic crystalline. However, only certain wavelengths may pass through them. These acoustic materials can be used to create masks for sound waves, so that specific portions of bulk substrates are excited. The metamaterial can also be present in liquid crystalline materials (e.g. LCD liquid crystal display), where the “pixels” are? The display’s metamaterial may also be present as a liquid crystalline material (e.g., in a liquid crystal display, LCD), where the?pixels? serve to direct, direct, block or otherwise act as a gate for emission through the display (e.g. template, mask, etc.) and into bulk material. Any of the embodiments herein that use a dynamic template should be considered. They may have one or more screens that are adjustable or non-adjustable and can be programmed to be open, close, focused, etc. so that one or several emitters can generate concentrated energy in a region or point within a chamber.
It is possible to design manufacturing systems that can produce articles of manufacture with a variety of outer geometries and almost any material. Manufacturing systems may be able to produce articles of various complexity, such as food and beverage containers, high-tech prototypes and food preparation (e.g. using emissions directed towards edible material).
“Further,” because these techniques can be applied on different scales, it’s also possible that manufacturing systems according to the present embodiments could be used by small businesses or individuals. Instead of purchasing individual articles of manufactured goods from warehouses or commercial suppliers, a consumer can purchase bulk quantities of base material that can then be used to build articles of manufacture as needed. It may be possible to produce items on-site in the environment they are intended. This could reduce shipping and storage costs. It may be possible, for example, to make playground equipment out of polymer pellets or granules and/or powder on a playground site. Or to make vehicle parts at a site that builds vehicles.
“In a general sense, the present disclosure enables the manufacture of individually-designed items from a bulk material, which may be referred to as a bulk substrate, using emissions directed toward the bulk material in a controlled manner. Depending on the type of emission used, the emissions can cause bulk material to combine in a way that is consistent with its chemical or physical characteristics. Referring to FIG. FIG. 1 shows a schematic representation for a process 10. This is representative of how an additive manufacturing system might produce an article of manufactured using focused emissions. The process 10 may use an emission system 12. This is generally designed to direct emissions towards a bulk substrate 14. In controlled fashion, this allows for optically, thermally and vibrationally-driven processes to occur in the substrate. In embodiments where the emission system 12 causes phonon generation/propagation in the bulk substrate 14 to facilitate desired product formation, it may be referred to as a phonon generation system. Bulk substrate is a term that can be used to describe a variety of bulk substrates. This term “bulk substrate” can be used to refer to granular substrates, layers, and other substrates that could be affected by the chemical or physical transformations described in this document.
The emission system 12 could include one or several emission devices that emit energy (e.g. optical, vibrational or thermal), capable of interfacing with bulk substrate 14 (e.g. to cause vibration and/or heat in the materials) and/or one of the features of a focus system to adjust (e.g. to amplify and/or transform emissions into emission of an alternative frequency or wavelength). One or more control devices may be included in the emission system 12, such as a single control system or a distributed control system. This control system coordinates emission from the emission devices and various other devices within the system 12. The emission system 12 could include systems or devices that focus one or more beams on a specific area of the substrate 14 rather than the entire substrate 14. Additional or alternatively, features may be added to the system 12 to limit the emission to a specific area of the substrate 14.
“The bulk substrate 14 can contain any combination or one of the materials that is capable of undergoing a physical or chemical change due to interactions with the emission from the system 12. Materials may also be called ‘phonon-reactive’. Materials that are phonon-reactive can be defined as materials that generate enough heat or vibration to cause product formation. Another example is photo reactive materials. These materials can melt according to a specific vibrational frequency or include materials that can be sintered by heat and vibration (e.g. metals, ceramics). The present disclosure does not apply to all types of materials. It is intended for illustration purposes only. The bulk substrate 14 could include a metal, a clay (e.g. metal oxides, semimetal oxides), clay or glass, a plastic resin such as a pololefin resin, a pololefin resin, e.g. polyvinylrene resin, polystyrene resin), an elastomer (e.g. polydimethylsiloxane, polybutadiene), and polyphenylenesulfide, (PPS), sulfide, and so forth).
The substrate 14 can be found in many morphologies. It may be dry, in suspension or in a solution. When the substrate 14 is dried, it may be in the form of granules. This is meant to include powder, pellets, or flakes. If the substrate 14 material is in solution, it may be present as a solute. This may allow photocatalytic and other optically-driven processes, such as heating, to be performed in accordance the present disclosure.
The bulk material can be placed in a housing or chamber to allow for the accumulation of substrate 14 in a way that facilitates the described processes. These features can be called a “build chamber”, which can be connected to different systems to fill and drain the chamber. This will allow sufficient transmission of the device emission to the emission system 12 to interact the material.
“Moving left to right in FIG. 1. The process 10 includes the step of directing controlled emission (step 16), toward the substrate 14, which can result in phonon generation/propagation or other controlled excitation of substrate 14. For example, during phonon generation/propagation, one or more emission devices of the emission system 12 may emit some type of energy that causes vibration in certain areas of the bulk material of the substrate 14. The phonons may be either thermal, optical, acoustic or a combination of both depending on how they interact with the material. According to the art, thermal and optical phonons correspond to random vibrations within a lattice of atoms and molecules. Acoustic phonons correspond to coherent wavelike vibrations within the lattice structure. Optical phonons correspond to vibrations where the first and second types of atoms move in opposite directions. The overall thermodynamics of a lattice is affected by the sum of these phonons. These phonons can be used to produce vibration and/or heating within the bulk substrate 14 in accordance with an embodiment according to the present disclosure.
“As shown in the emission step 16, a region with a pattern 18 in the substrate 14 (a focal region for the emission devices of emission system 12), undergoes a transition between an initial state and a state in which one of several materials (e.g. One or more atoms are excited. The device emission can cause materials in the area 18 to transition from a ground or other state to an excited condition. This excited state may result in, for example, phonon generation by a lattice made of the material. Alternately, controlled emission according to step 16 could be acoustic emission that causes wave propagation through bulk substrate 14 and to the focal point or region. In certain embodiments, the collective excitation of molecules and atoms at the focal point or area may result in wave propagation through the bulk substrate 14. The wave can have quantized properties that can then be used to cause the chemical or physical change required herein to make articles of manufacture. Three-dimensional excitation, such as excitation along a length and width, may correspond to a desired pattern that corresponds to all or part of a product.
The emission process can be stopped after the 16th step is completed. This could be a result of no further excitation in the bulk substrate 14. A manufacture part 20 can be produced after the excitation period is over.
“The manufactured part 20 can be isolated using a process shown in FIG. 1. Bulk substrate removal (step 22). Bulk substrate removal may, for example, include the draining of a solution of bulk substrate, powder removal or pellet removal, flake and the like. It should be noted that acts performed in accordance to step 22 results in isolation of the manufacturing part 20.
“While the embodiment described above in relation to FIG. While the embodiment discussed above with respect to FIG. 1 can be applied to many manufacturing techniques, this discussion is primarily focused on additive manufacturing. It should be noted, however, that the disclosure also covers subtractive manufacturing techniques. FIG. 2 illustrates an example of subtractive manufacturing. Schematically, FIG. 2 shows a process 30 for subtractive manufacturing. A process 30 could use an embodiment of the emission method 12, which is similar to that shown in FIG. 1. However, it can be used or may use different energies or intensities or other emission parameters to cause cleavage from one part of the substrate.
The process 30 could use the emission system 12 in order to refine a rough-machined part 32. Any solid material that can interact with the emissions from the emission system 32 is considered a rough manufactured part. The rough manufactured part 32 could include, for example, a block made of polymer resin or a ceramic block. It may also contain a more refined article of manufacturing, such as an additively formed rough part. The additive manufacturing techniques include light-based additive manufacturing and ultrasound additive manufacturing. In these cases, layers of the substrate are placed on top of each other to create the rough manufactured part 32. The process 30 is different from these techniques in that instead of building up parts, or essentially adding pieces to the part, the process uses emissions sufficient for portions to be removed. The process 30 follows the same steps as FIG. 1. in directing controlled emission toward the substrate 14 (16).
“The emission according to step 16 of FIG. However, FIG. 2 differs from the one shown in FIG. 1. The excitation takes place in a part 32 that has been manufactured and is used to remove material. The controlled excitation can cause vibration, shock and pressure in certain embodiments. The boundary 34 of excitation is generated by controlled excitation according to step 16. The boundary 34 can be used to define the geometry, shape, and size of a refined manufactured piece 36. After controlled excitation has been performed for a specified time, the refined manufactured parts 36 are produced. Controlled excitation can, for instance, cause vibrations in the base material (e.g. an adjustment in frequency of atomic oscillation). This may be sufficient to remove certain sections from the part 32 and create patterns in the part 32 (e.g. the boundary 34 of excitation). This process can also be used in creating designs, indicia and so forth in the refined manufactured 36.
“Because the refined part 36 is made from a solid bulk material it can be isolated (step 38). This is done by simply removing the remaining rough part 32. The scrap material from the process 30 can be used as a recycling feed in certain instances.
“While the above described the present methods in the contexts of additive and subtractive manufacturing, it is important to note that the present disclosure could also apply to methods for combining different parts to create multiple combined products. FIG. 3 illustrates an embodiment of such combination process 50. The emission system 12 may be used to combine a first manufactured piece 52 with a second manufactured piece 54 to create an article of manufacture.
In a general sense, the first two manufactured parts 52 and 54 can be considered to have been made from base materials such as metals, polymer resins, ceramics, etc. The manufacturing process for the first and second manufactured parts 52 and 54 could have included blow molding, extrusion, sintering and molding. This is not limited. According to the present disclosure, excited areas (e.g. regions of certain phonons), are generated in the first 52 and second 54 parts, or a combination of both. The excitation areas may be the regions where phonons can be generated and/or propagated. These phonons have an energy sufficient for vibration and heating the first and/or the second parts 52, 54, so that they are combined via melting, sintering or the like. The controlled emission (step 16), will be included in the 50-step process, as described above with regard to FIGS. 1 and/or 2.”
“As shown in the figure, the first manufactured piece 52 may have an initial boundary 56, and the second manufactured piece 54 may have another boundary 58. The region of overlap 60 is where the weld will be formed. The area of overlap 60 does not necessarily have to be the one where the first boundary 56 is in alignment with the second boundary. The region of overlap 60 could be simply one where the boundaries 56 and 58 are in direct abutment to one another. To facilitate discussion, however, the current technique is described with one or two manufactured parts 52 and 54 placed over each other to create the overlap 60.
“As shown in the figure, the emission system 12, after performing the step controlled emission 16, may produce an area with a pattern excitation 62. The region of overlap 60 may have a different size, shape or other geometrical parameter than the pattern of excitation 62. The pattern of excitation may not correspond to the size or shape of the area of overlap 60. However, it may cover a small portion of the overlap 60. It is possible that the pattern of 62 only covers a portion of the overlap 60. As it is currently considered, the first and second manufactured parts 52 and 54 could be sufficiently coupled by a geometries defined by pattern of excitation62. Alternativly, the pattern excitation 62 could be dynamic rather than static. The pattern of excitation 62 could be defined as a region in which excitation takes place on a specific portion of the first or second manufactured parts 52, 54. This region (e.g. the focal region) can be moved during the 50. To couple the first and second manufactured components 52, 54 together, excitation can be done by scanning over the entire region of overlap 60. After excitation ceases completely in accordance to step 64, a combined manufacturing part 66 can be formed. It may also include a joint where the two parts are joined together. A joint 68 can be defined as a region in which the constituents of the first manufactured parts 52 and 54 have been exposed to sufficient excitation (e.g. phonon generation), to melt, sinter or combine in such a way that they are linked together in a substantially permanent manner, or less permanent, if desired.
“The 50 process can be used to make a variety of articles of manufacture. The first and second manufactured parts 52 and 54 could include separate portions in a beverage container, separate sections of a pipe or separate portions from an appliance, separate pieces of playground equipment and so forth. These examples show that the first and second manufactured parts 52 and 54 can be combined to make a single beverage, food container, pipe, appliance, or playground equipment using one emission or a single set overlapping emissions from the emission system 12.
“As can be seen from the above, the techniques described in the present disclosure can produce various articles of manufacturing using one or more emission device that emit light, heat and sound toward one or both of the bulk substrates. One aspect of the disclosure allows for one or more emission devices to be controlled (e.g. A controller can direct the emission towards one side of the bulk substrate 14. FIGS. FIGS.4-6 illustrate, for example, examples of embodiments where a dynamic templates may be used to allow formation of all or part of the article of manufacturing 20 from one side of the bulk substrate 14.
“In particular, FIG. The process flow 70 is shown schematically in FIG. 4 using a particular version of the emission system 12. An emission device 72 may be included in the emission system 12. This device, as will be described in more detail in subsequent illustrations, can be controlled in many ways. According to the present embodiments, the emission system 72 (or any other emission devices) can be a source or source of optical emission, acoustic emission, thermal emission, electron beam emission or, in some cases, multiple emission devices that direct optical, acoustic or thermal emission towards the substrate. Except as noted, the description above and below for the emission device 72 can be taken to cover all of the emission devices listed herein.
“In embodiments in which the emission device 72 produces optical emissions, the emission device or emission devices may include a laser (or other optical source) with sufficient operating parameters to cause the desired process to occur within the bulk substrate. Non-limiting examples of such processes may include melting, photocatalytic reactions, curing, heat generation via vibration and/or thermal phonon generation/propagation, and the like.”
“Emission device 72 may be configured to emit sound waves. The device can include any device that produces one or more tones at one of the desired frequencies such as speakers, piezoceramic disks, or other devices. The emission device 72 can be controlled to produce multiple frequencies at different phases. Some frequencies may be able to cause phonons in bulk substrate 14 to be produced and/or propagated. These phonons may possess certain desirable characteristics that allow them to perform the following techniques. The acoustic emission and the resulting Phonons may have desired properties. For example, a vibrational frequency that can cause enough heat or pressure to form in a specific (e.g. focused) area of the bulk substrate 14 In some embodiments, the emission devices 72 can emit frequencies lower than traditional acoustic frequencies. These frequencies may be amplified or interfered with to cause vibrations in the bulk substrate 14.
“In further embodiments, an emission device 72 could include all or part of an electron laser system. The emission device 72 can use electrons as a lasing media in such embodiments. An element that interacts with electrons can cause acceleration and other types of emission to be generated (e.g. optical, acoustic or microwave). Synchrotron radiation is an example of synchrotron radiation. This includes optical emission from accelerated electrons. You can direct the emissions to the build chamber 16 using certain beam steering features (e.g. electromagnetic devices) and/or other masking and templating elements (e.g. of the emission system 12.
The depicted embodiment includes a dynamic template (74) to allow emissions from the emission device 72 into the build chamber 16. The dynamic template 74 could be considered an optical or acoustic masking device. It may include one or more screens. In a broad sense, the dynamic template 74 is designed to interact with emission 76 from the emission device 72, and produce a concentrated or constrained emission (78). The dynamic template 74 is described in more detail below. However, the dynamic template may also include any device that can block emissions 76 from the emission devices 72 in certain areas. It may also allow certain emissions 76 to pass through in other areas. The shape, size and transmitting characteristics of these areas can be changed by the dynamic template 74, as described herein. The dynamic template 74 can be used to modify which areas of the template 774 are capable of blocking the emissions (or reducing their formation) and which regions of template 74 allow transmission of the emission 76 (or enabling them to form the emissions 75) towards the bulk substrate 14.
“The dynamic template (74) may be, in some embodiments, considered a metamaterial. This is a material that includes many different materials with different transmittance or absorption properties relative to the emissions 76. According to present embodiments, dynamic template 74 could include an acoustic metadata, which is a material that interacts with the emission device 72 in a specific way. According to other embodiments, dynamic template 74 could include an optical metamaterial. This is a material that interacts with the emission device 76 in particular ways. The acoustic metadata of the dynamic templates 74 may include physical features, such as inclusions, that allow certain frequencies of sound through the template 74. The periodic spacing will generally approximate sound wavelengths and frequencies. Similar relationships exist for optical metamaterials, and optical emissions. The dynamic template 74 can include a stack or cards of screens, cards, etc. with regions of different electrical, thermal, and acoustic transmittance. To allow appropriate energy/emissions to flow, individual screens/cards may be moved in relation to each other.
“In general, the dynamic template74 will contain at least two distinct constituent materials. These materials can include solids (e.g. metallic, ceramic, or polymeric), inclusions that are disposed in a matrix such as a liquid-crystalline matrix. The dynamic template 74 can be compared to a liquid crystal display in this manner. Additional details regarding the dynamic template 74 can be found in FIG. 5. The dynamic template 74 can be used in some embodiments as a masking device and a waveguide, such as a phonon waveguide, phononic, or even a crystal phoxonic. The dynamic template 74 can be used to direct light, heat or sound waves, or any combination thereof in controlled ways, towards the bulk substrate 14. The type of emission 76 and the method used for making the article 20, among others, will determine whether the dynamic template 74 is in direct contact with the substrate material.
“Again, the emission device 72, the dynamic template 74 and any control, filtering and/or transducing equipment work together to direct controlled emissions towards the bulk substrate 14. The illustrated process 70 in FIG. 4. The controlled emissions 78 are directed towards layers of a bulk substrate in the illustrated process 70 of FIG. The corresponding geometry may be formed in one layer, which is a departure from traditional additive manufacturing techniques. In accordance with certain embodiments, and as further described below, it is possible to form an entire part at once. This can either be in addition or instead of defining geometries in individual layers. To put it another way, different parts of an article can be formed by a single controlled emission step. This allows for complex patterns and shapes to be created in each layer. A single emission step could be used to create a base for a water bottle, or any other complex geometrical feature. The layers do not have to be of a specific thickness. They can be thicker than layers that are typically made by sheet extrusion techniques. The controlled emissions 78, which are directed towards a first layer 80, of the bulk substrate, will be performed in accordance to step 16.
“This controlled emission produces a first pattern 82 that corresponds to a cross-section from a three-dimensional image. This first layer 80 of bulk substrate will be used to produce the excitation. The first pattern of excitation (82) may be either an optically-induced or acoustically-induced. According to an embodiment, vibrations may be generated by the first pattern of excitation82 to produce localized heating sufficient to write cross-sectional geometry directly into layer 80. The first section 84 of the manufactured piece 20 may be used as the cross-sectional geometry. Any size, shape or other geometrical parameter may be used for the first pattern of excitation (82). These geometric parameters can be controlled in a variety of ways, as you will see from the discussion below.
“After creating the first portion 84, you can add a new substrate layer (e.g. a second layer 86) to the top of the first layer 80 (step 87). The advantage of layer-by-layer approach as shown is the possibility to incorporate different materials into the manufactured article 20. The second layer 86 can be different from the first 80 in terms morphology, size and material composition. The second layer 86 is approximately the same size as that of the first layer 80.
“After the second substrate layer is added, the 70 process may include adjustment of the dynamic templates 74 and continued controlled emission (step 88) The emission device 72 could continue to emit 76 towards the dynamic template. The dynamic template 74 has been adjusted according to step 88. Therefore, the focussed emissions directed towards the substrate could be considered a second focused emission, 90 different from the focused 78. The dynamic template 74 might adjust the size or shape of certain areas to allow the emission 76 through the template. While others block the emission, The result of dynamic template adjustments and continued emission may be a second pattern 92. The second pattern excitation 92 has a general size and/or form determined by the adjustment to the dynamic template 74, and may have a geometry that approximates the cross-section of article 20.
“It is important to note that continued emission may occur in accordance to step 88. The second region of phonon generator 92 may have sufficient energy or sufficient excitation to cause that second region 92 to be connected to the first part of the manufactured part. This could be done, for example, by melting, sintering or curing. In embodiments in which both the first and second polymeric layers 80,86 are present, the second pattern 92 of excitation may be sufficient to cause a portion the second layer (86) to melt and seep into spaces or pores at the boundary 94 between the first part of the manufactured part 84% and the second region 92%. Alternately, in embodiments where both first and second layers 80 and 86 are metallic or ceramic, the second excitation pattern 92 may be sufficient to cause a portion the second layer (86) to melt, weld or sinter and/or seep into the boundaries 94 between the first part of the manufactured parts 84 and the first region 92. In one embodiment, the second excitation pattern 92 may be sufficient to form a metallurgical link between the first and second regions 92.
“As shown in the figure, the above processes can be continued in a series denoted with arrows96 to create an embodiment of the manufactured piece 20. This series of steps 96 could include additional layers of the same, different materials or material morphologies. They may also produce the same, or different types, of emission from the same, or different emission devices. The same, or different patterns or templates of masking can be used. According to the process 70 in FIG., the final product is the article 20. 4. This will depend on the materials used and the number of layers.
The manufactured part 20 can include multiple portions, including the first portion 84 and the second portion 100, which are both produced from the second area 92. A third region, 102, is produced by at least one additional layer deposition and excitation. The manufactured part 20 may be connected using vibration, phonon generation, sintering or melting, or any other method that is compatible with the invention.
“According to the present embodiments, different parts of the manufactured part 20 in FIG. Each of the 4 may be made from a single layer and may have a thickness determined by the materials used for manufacturing. The capabilities of the emission devices 72, the type and configuration of the dynamic templates 74, may affect the thickness of each section. Some materials, for example, may allow a standing vibrational waves to be produced (upon excitation), along specific distances. The distance could correspond to the thickness of the layer and the nature the material. The emission device 72 could also have specific capabilities such as emission intensity or emission flux as well as other emission constraints.
FIG. The dynamic template 74 is used to create layer-by-layer additive manufacturing. However, the present techniques can be applied to other types of additive or subtractive manufacturing. Referring to FIG. FIG. 5 shows an example of the present embodiments. It may include an embodiment 120 that produces the article of manufacture without adding layers or in one step. In certain embodiments, the article may be made by producing three-dimensional excitation within a bulk substrate 14. This three-dimensional excitation corresponds with all or part of the geometry 122 in the article 20.
“The bulk substrate 14 that is used in making the article of manufacture 20 can be placed within a chamber 124. This chamber is designed to hold the bulk substance 14 in a way that suits the manufacturing method. The bulk substrate 14 could be provided as granules such as a powdered bed or a packed arrangement pellets or other similar solid morphology. The bulk substrate 14 can also be present within the build chamber as a solution solute or solid in suspension or slurry. It is possible that certain embodiments described in the present disclosure will enable the formation and precipitation of the article 20 in solution, as discussed below.
“It is important to note that FIGS. The configurations shown in FIGS. 1-4 include configurations where one or more substrate sides (the bulk substrate 14), are exposed to emission from one or several emission devices. FIG. 5 shows an embodiment of the dynamic template 74. FIG. 5 shows the combination of the dynamic template 7 and one or more emission devices to emit from the bulk substrate 14. One embodiment may only include one emission device. In other embodiments, there may be multiple emission devices. One more example is that the emission device 72 may only be an optical device capable of emitting photons with sufficient energy to cause absorption on the bulk substrate 14. This can cause heating, curing, photocatalytic reactions, and the like. Another particular embodiment of the emission device 72 may include sub-acoustic and acoustic emission units that emit sound waves or vibrational waveforms. In some embodiments, the sound waves or vibrational wave may be amplified in order to produce a desired response in bulk substrate 14. (e.g. vibration, pressure, shock) in order to cause sintering or melting. Another, more specific embodiment of the emission device 72 may include only emission devices that cause heating in bulk substrate 14. This could include photon absorption by bulk substrate 14 and an associated rise of temperature sufficient to cause melting. The dynamic template 74 can be used to focus the wide-band emission from the emission device 72 on a particular area of bulk substrate 14. This may cause heating, melting or sintering.
The dynamic template 74 can be placed in contact with one or both the bulk substrate 14 and build chamber 124 or it may be separated from either of them. The build chamber 124 is shown in the illustrated embodiment. It is located at an abutment to a first side (126) of the build chamber 124.
“As mentioned above, the dynamic templates 74 can include a combination or materials that allows selective transmission of emissions from emission device 72 to the bulk substrate 14. The illustrated dynamic template 74 has a matrix 130 and inclusions 132, as shown in the expanded section 128. One embodiment of the dynamic template 74 includes a matrix 130 and inclusions 132 that are transmittive to emissions from the emission device 72. The inclusions 132 can be opaque to these emissions to prevent them from reaching the substrate 14. One aspect of the inclusions 132 could have anisotropic transmittance depending on the orientation they are within the matrix 130. For example, inclusions that are nanomaterials (e.g. iron nanoparticles and nanotubes) may exhibit anisotropic transmittance. In one embodiment, the inclusions of 132 can block transmission of emissions 76 in one configuration while the inclusions of 132 permit the emission to pass through the template. 74 in another configuration. Alternate embodiments may have the transmittive properties of both the matrix 130 or the inclusions 130 reversed. In this case, the matrix 130 becomes opaque relative to the emission while the inclusions 130 are transmittive (e.g. always transmittive).
“As shown in the expanded portion 128, inclusions 132 or the matrix 130 can be controlled to create a guide path 134. In accordance with some embodiments, the guide path 134 may be used as a waveguide to direct emission from the emission device 72 through the dynamic template. 74. This controlled transmission of emissions may allow the dynamic template to direct emission from the emission device 72 to a specific region of the bulk substrate 14, within the build chamber, 124 (e.g. a focal area). The inclusions 132 or the matrix 130 may be included in the guide path 134. Or, it may include both the matrix 130 and the matrix 130. The specific material composition of guide path 134 could depend on the transmittance properties and emission characteristics of the emission device 72. The guide path 134 can be programmed to produce an optical or acoustic material with wavelength-selective and frequency-selective transmittance. The periodicity of inclusions 132 can be controlled to match the desired wavelengths or frequencies for transmitting to the bulk substrate 14. The inclusions 132 can be programmed to have a spatial periodicity that corresponds to the desired bandgap of the waveforms.
The matrix could include liquid crystal materials such as liquid crystals or water, as well as diluents like alcohols, organic fluids, and so forth. Non-limiting examples of inclusions 132 include granules made from polymeric, ceramic, metal, and the like. As an example, inclusions 132 could include nanomaterials like nanotubes and nanoparticles or nanospheres. This includes any combination of carbon, boron or nitrogen, iron or copper.
“According to an aspect of this disclosure, the matrix 130 and the inclusions 132, or any combination thereof, can be considered to comprise all or part of a movable matter within the dynamic template. 74. Any material that can be moved, controlled or oriented using one or more control devices communicating with the dynamic templates 74 is called a movable material. The matrix 130 and inclusions 132 can behave similarly to liquid crystal displays. In this case, either the matrix 130 or the movable material 132, or both, electrical signals generated from a control device are used to position or direct the matrix 130 or both. FIG. 5 shows an example of such a control system. FIG. 5 is a template control circuitry 136.
“In embodiments in which the matrix 130 or the inclusions 132, or both, can be addressed using electric signals, the template circuitry 136 might include one or more electronic circuits that are capable of addressing subsets of the dynamic template (e.g. pixels, voxels). The template control circuitry (136) uses electrical signals to adjust the patterns of the matrix 130, inclusions 132, or both within the dynamic template. This is done to control the transmission of emissions from emission device 72. One example is that the template control circuitry 13 may contain electronic circuits placed around the periphery of the dynamic template 774 or any other arrangement of electronic circuits. As noted, individual pixels and voxels can be used to focus, block, focus, or de-focus the emissions.
Magnetism may also be used to address the matrix 130 or inclusions 132. One example is that the template control circuitry (136) may contain one or more magnet elements, which can be controlled (e.g. energized) to create controlled magnetic fields within specific areas of the dynamic templates 74. The magnetic field may be used to address the matrix 130 and inclusions 132, thereby creating patterns in the dynamic template. These patterns could correspond to one or several guide paths, as shown in the expanded area 128.
“As shown in FIG. “As also shown in FIG. 5, the system 10 may contain a controller (e.g. a system controller 140), which coordinates the operation of dynamic template 74 via template control circuitry 136, and operation of one or more emission device 72. The system controller 140 can include one or more processing device 142 at different locations. The processing devices 142 may also be configured to execute instructions stored non-transitory memories 144. These instructions may contain a variety control operations that allow the system 10 to produce article 20. The system controller 140 can also contain other control devices that facilitate the operation of the emission device 72, the dynamic templates 74, and positioning of the build room 124 in some embodiments. These embodiments will be described in greater detail below.
“In one embodiment, the system controller 140 can be configured to perform computer numerical control (CNC), or other automated processes that produce article 20 in accordance with a three-dimensional model stored in non-transitory storage 144. The system controller 140 can adjust the operation 72’s emission device 72 based on the three-dimensional model. This includes adjustments to its position, emission intensity and flux, frequency of emission, etc. The system controller 140 can control the operation the dynamic template 74, in conjunction with other control actions that are based on the three-dimensional model. The system controller 140, for example, may be used to control an emission source (e.g. the emission device 72 or the dynamic template 74), to cause phonons to be generated in the base material as per the computer model.
“The system controller 140 can adjust the penetration depth of the emissions into the build chamber (124) and therefore the bulk substrate 14. This is a more specific, but not limited example. Alternately or additionally, the system controller 140 can adjust the emission spectrum of 72. These adjustments are possible in cases where bulk substrate 14 contains more than one material. Different materials might have different reactivities at various portions of the emission spectrum. Alternately, it may be possible to adjust the way that emissions from the emission device 72 are transmitted via the dynamic template 74. This could allow for the easier focusing of emissions to different areas of the bulk substrate 14.
“The system controller 140 can adjust one or more operational parameters within the dynamic templates 74. This may be done via template control circuitry 136, to adjust a particular section of the article-of-manufacture 20 that was formed at the specific point in manufacturing. The emission device 72 can focus emissions into areas to trace the geometry of article 20. This could correspond to “writing?” The article 20 is incorporated into the bulk substrate 14. The controller 140 can cause a change in the pattern of dynamic template 74 during manufacturing. This could occur upon the formation of a section of the article 20, which will result in a new pattern within the dynamic template. Also, an adjustment may be made in the article 20 that is being focused. This could lead to the formation of another section of the article 20.
“Additionally, or alternatively, system controller 140 can adjust a periodicity 132 of inclusions (e.g. in a focus region) to adjust which portions the emission spectrum are transmitted via dynamic template 74 (e.g. via the guide path 134) The dynamic template 74 can be used as a metamaterial such as a photonic or phononic crystal. The inclusions 132 in the dynamic template may be placed at a frequency that permits certain frequencies of sound to pass along the guide path (134) and towards the bulk substrate 14. The inclusions 132 can also be used as photonic crystals. They may be placed at a periodicity that permits only certain wavelengths of light to pass through. In certain cases, the dynamic template (74) may also serve as a photonic crystal. This would be a combination of a photonic and phononic crystal capable of controlling both the optical and acoustic emission directed at the bulk substrate. The dynamic template 74 can include periodicities, such as first and second periodicities, that are intended to control respective optical and acoustic wavelengths.
“In one operation sequence of the system 120 the system controller 140 may control operational parameter of both the emission devices 72 and the template. This allows for different sections to be formed in the article of manufacture 20. A solution may form a bottom section 146 of article 20, for example. This could allow the rest of article 20 to rest on the bottom portion 148 in the build chamber 124. As article 20 forms in the solution, it is not dissolved and the article 20 falls out of solution.
“As described further below, article 20 can be formed simultaneously by directing a three dimensional projection into the chamber 124 using, for instance, constructive interference of one or more emission devices, projection using predetermined difffraction patterns, or other techniques. The system controller 140 can adjust the dynamic template 7 to create an interference pattern. The emission device 72 may be activated as a laser to traverse the dynamic templates 74 and create a three-dimensional projection in the build chamber 124. The light can be projected onto a medium to create, for example, an image or portion of article 20 within the chamber 124. The light can be intensified by using constructive interference or other emitters to produce sufficient energy to trigger photocatalytic reactions within the bulk substrate 14. This could result in the article 20 as shown in the image.
“In this context, the dynamic template 74 may cause interaction among multiple wavefronts to allow further control over excitation of bulk substrate 14. This could cause interference to occur in particular places and at certain times. Now, let’s look at FIG. FIG. 6 shows an embodiment of a manufacturing process 120. It includes multiple emission devices. A first emission device 160 is shown and a second emission 162. These are configured to direct first and third emissions 164 and 166 respectively toward the bulk substrate 14. The first and second emission 164 and 166 are directed towards the bulk substrate 14 from one side (e.g. toward the first side of the build chamber 124) and via the dynamic template 74. The first and second emission 164,166 can be optical, acoustic or both. In certain embodiments, they may individually or collectively cause physical or chemical changes in bulk substrate 14 material. A portion of the article 20 may be formed by these physical or chemical changes.
“The dynamic template, as mentioned above, can be controlled by either or both the template control circuitry136 or the system controller140 to generate, for instance, one or more guide tracks that direct emissions towards the bulk substrate 14. The illustrated embodiment may allow the system controller 140 to cause the template control circuitry 130 to adjust the arrangement 132 of the inclusions to create multiple guide paths. This is shown in the expanded portion 170. The dynamic template 74 can form a first and second guide paths 172, respectively, which together may create a combined guide (176) to allow for enhanced interactions between the first and secondary emissions 164 and 166. An embodiment shows that interactions within the combined guide176 can produce a combined emission of 178. This is shown in a second expanded section 180.
“The combined emission of 178 could be caused by constructive interference, destructive interference or a combination thereof from the first and second emissions 164, 166. The combined emission 178 can have many characteristics, depending on the nature of the first or second emissions 164,166, and how they are guided through the paths 172,174. In one embodiment, for example, the first and second emissions 164 and 166 could be acoustic waves. You can select the frequencies and phases of the first and second emission 164, respectively, so that they interact in a predetermined way to produce the combined emission (178) with desired characteristics (e.g. frequency, power).
One aspect of the disclosure is that the combined emission of 178 can be generated in such a way that, when combined emission of 178 deposits energy into the bulk substrate 14, (e.g. an atomic lattice), then the molecular arrangement of 181 vibrates at a frequency and power sufficient for the bulk substrate to melt, sinter or the like at a predetermined spot within the build chamber. Additional expanded region 180 may further illustrate this process. The molecular arrangement 181 could be an atomic or molecular structure such as a crystal structure. It is located within the bulk substrate 14, in the build chamber 124, at a focal point, focal area, or focal point.
“In certain embodiments, when the combined emission is acoustic, the molecular structure 181 may be created by interaction with the combined emissions 178 with a pressure wave. This pressure wave can be used to produce shockwaves that are focused at predetermined locations on the bulk substrate 14. Alternately, the combined emission of 178 could impart energy to molecular arrangements 181 (e.g. a single granule, or a collection, of bulk substrate 14), such that the molecular structure 181 oscillates at the superharmonic frequency associated with the combined emission of 178. Superharmonic oscillations of the molecular arrangements 181 could result in heating the bulk substrate 14 which, in turn, forms all or part of the article of manufacture 20.
“The system controller 140 can cause the template control circuitry to adjust the positions 172, 174, and combined guide 176 during operation of system 120 to alter the portion of substrate 14 that is subject to the combined emission. The system controller 140 could cause the template control circuitry 136, to divide the combined guide path 171 into multiple paths, thereby exposing multiple areas of the bulk substrate 14 the combined emission 178. The combined guide path 176 could be split into divergent paths to allow for the formation of multiple heated regions in the bulk substrate 14.
“In a similar fashion, the template control circuitry 13 may cause the first and the second emissions 164,166 to be directed to multiple combined pathways or to be directed entirely independently through the dynamic template74 and to the bulk substrate 14 in a similar way. Multiple emissions directed simultaneously to the bulk substrate 14 have one technical effect: multiple parts of an article may be made at the same time.
“As in the embodiments discussed above with regard to FIG. “As with the embodiments described above in relation to FIG. 5, the depth of an emission focus (and energy deposit) in the bulk substrate 14, (e.g. as determined by distance between the first side 126, and the second side 182, opposite the first), can be varied by changing parameters of the emission device 160, 162, or dynamic template 74. A periodicity of inclusions 132 in the first guide pathway 172, the second path 174, and the combined guide route 176 may be adjusted to adjust (e.g. filter) the component frequencies of emissions. This acts as a phononic crystalline that allows only certain wavelengths through dynamic template 74. Alternately, you can adjust the power and intensity of emission devices 160, 162, or the interactions between multiple emissions at controlled places.
“Indeed the dynamic template 74 described in relation to FIGS. The 4-6 templates can be used in conjunction with other masking or template features. FIG. 12 shows an example of the system 120. 7. The dynamic template 74 can be used on the first 126 side of the build room 124. A second mask or additional dynamic template, 190, may be used on the third 192 side of the building chamber 124. Multiple masking/templating options may be used to produce different emission sources (e.g. multiple dynamic templates). As shown, the third side 192 is oriented in crosswise relation to the first and secondary sides 126, 182. The additional dynamic template, 190, may be oriented in a crosswise direction relative to dynamic template 74. This configuration could be advantageous to allow emissions to be directed through the dynamic templates 74 and 190, interfering (constructively as well as destructively) within the chamber 124.
“As an illustration, the system controller 140 might cause the additional dynamic templates 190 to create a first pattern 194 (using respective inclusions, matrix and template control circuitry), this may correspond to a three-dimensional or first shape for excitation. The system controller 140 could cause the second emitting device 162 to direct second emission 166 towards the third side of the build chamber. 124 An additional dynamic template, 190 with the first pattern 194, could cause the second emission to 166 to produce the first three-dimensional projection within bulk substrate 14. The first three-dimensional projection corresponds excitation of bulk substrate 14 in a specific region (e.g. the regions of phonon generator in FIGS. 1-3). The second emission 166 in certain embodiments may excite the bulk substrate 14 in an area extending from the third 192 side of the build room 124 to the fourth 196 side of the build hall 124. This region is generally defined by the dimensions in the additional dynamic template 194 and the general boundaries of the first pattern 194 therein.
“At the same, the system controller 140 could cause the first emitter 160 toward the first side of 126 through the dynamic template. In combination with the template controller circuitry 136 the system controller 140 may cause the dynamic templates 74 to create a second pattern (198) using the inclusions 132 and the matrix 130. The first emission, 164, is directed at the bulk substrate 14, through the second pattern, 198. It may interact or interact with an excited bulk substrate 14, to cause a physical and chemical change in the material (e.g. heating, melting, curing). The interaction could result in an increase in the oscillation rate of an atomic layer of the bulk substrate 14, for example. In general, the first and the second emissions are directed in crosswise intersecting directions into the build chamber 124, to cause interference or to increase the emission intensity at focal points and regions of the bulk substrate. This is how one of the emission, e.g. the second emission 166, serves to generate an exccitation template onto which the other emission, e.g. the first emission 164, is projected to create a three-dimensional pattern with sufficient excitation energy for all or part of the article 20 into bulk substrate 14.
“In the illustrated embodiment, the first and second emissions 164 and 166, respectively, would overlap or cause interference to form section 202 of article of manufacture 20. The first and second emission 164 and 166 can be static in certain configurations. However, the dynamic template (74) adjusts the inclusions 130 and/or matrix 130 to move second pattern 198 in a direction 200 to form different sections (including section 212) of the article. The other way it works is that while one emission forms a three-dimensional projection within the build chamber 124, and does not move, another emission scans the area 200 to cause a change of material in the bulk substrate 14. Three-dimensional projection is a term that can be used to describe the phenomenon. As used herein, the term “three-dimensional projection” may be used to refer to either a three-dimensional projection or the effect of an emission on the substrate in three dimensions.
The system 120 in FIGS. 2 and 3 will vary depending on the material of bulk substrate 14 or the intensity of emissions. Articles of manufacture may be formed using the process described in FIGS. 5 and 6. The bulk substrate 14 is then written into the build chamber 124. These embodiments are not like traditional additive manufacturing techniques. Instead, material may be added gradually to the build chamber 124-6 during manufacturing. This progressive addition can be done in certain circumstances, however, for example to settle or introduce new materials into the chamber 124. The use of a dynamic template, as described above, may allow for a progressive formation of article 20 or an “all at once?” Formation of the article 20.”
The dynamic template 774 is a useful tool for controlling, filtering and controlling certain types or emissions from the build chamber 124. However, certain embodiments may not require the use of dynamic template 774. Other features that focus, transduce or filter the emission directed at the bulk substrate 14 can be used in accordance to the present disclosure. They may also be combined with the dynamic template. FIG. FIG. 8 shows a perspective view showing an embodiment of the manufacturing process 120 with such a configuration. The system 120, specifically, includes the first emitting device 160. This device is designed to direct the first emission (e.g., a wavefront) towards a focusing device 220 that is located between the first side of the build chamber 124, and the first emission devices 160. The first emission 164 can be either acoustic or optical. The emission device 160 could be any device that can produce such emission.
The system controller 140 controls at least partial operational parameters of first emission device 160. This includes the timing, power and flux of the first emissions 164. It may also control operational parameters (e.g. tilt, distance relative the first emitter 164 and/or build chamber 124) of focusing device 204. The system controller 140 can be communicatively connected directly to the focus device 210 or to a mechanical actuator (not illustrated) attached to the focus device 210. The focusing device (210) may be used to focus or expand the first emissions 164 in certain embodiments to control the regions of the bulk substrate 14. One aspect of the present disclosure is that the focusing device (210) may be used to transduce and focus the first emissions 164 in order to produce a transduced emission (212). The focusing device 210 can adjust the frequency, phase, or other parameter of the first emissions 164.
“For instance, the first emission 164 could be an optical wavefront and the transduced emission 221 may be an acousticwavefront. The opto-acoustic transmitter may be included in such embodiments. Another example is that the first emission could be an optical wavefront and the transduced emissions 212 may be of another wavelength and/or frequency (e.g. sufficiently tuned to cause melting//sintering in bulk substrate 14).
“In embodiments in which the opto-acoustic transmitter 210 is a focusing device, the 210 may contain one or more materials that absorb the first emission (164), undergo excitation and emit sound or other low frequency signals (e.g. vibration). One example is that the focusing device (210) may contain one or more layers (e.g. carbon nanotubes), which are placed on a lens (e.g. a fused silica optic lens) and designed to absorb the first emission (164). One or more layers may heat up due to this absorbance and transfer heat to additional layers of expandable materials, such as polydimethylsiloxane, (PDMS). The layers of the expandable materials may show thermoelasticity when heat is transferred to them. This can cause rapid expansion and contraction, which in turn generates high-frequency sound waves (e.g. 15 MHz). “The nanomaterials and the elastomer could be placed on the concave surface (or optical lens) of the focus device 210. This may allow for the use of focusing methods similar those used in optics (e.g. using calculations of focal length based upon physical parameters of focusing device.210).
According to the present embodiments, transduced emission212 could produce a pressure wave through bulk substrate 14. A focal region 214 is characterized as having an extremely high pressure relative to its surroundings. This is sometimes called a peak pressure and can lead to shockwaves within the bulk substrate 14. Because of the high and low pressure waves in the bulk substrate 14, non-linear propagation may result in shockwaves within the bulk substrate 14. The shockwave could cause enough energy deposition in the bulk substrate 14 for the focal area 214 to undergo a physical alteration to cause melting, sintering or other similar effects. In certain embodiments, shockwaves may be sufficient to cause portions of predetermined sizes to combine and form an article of manufacture.
The power of the first emission device 160 may control the amplitude and strength of shockwaves generated by the transduced emission. This may be used to implement a pulsed laser equipped with a beam extender. The beam expander can be used to expand the laser’s focus so that it interacts with the entire focusing device (e.g., a whole lens surface) 210. The geometry of the lens (e.g. its diameter and curvature) and power of first emission device 160 may control the location of the focal region (e.g. distance from the first side 124 of the build-chamber 124) within the buildcham 124. The amount of energy that is deposited in the opto-acoustic transducing material and the energy of the emitted sounds waves may be affected by the power of the first emitting device 160. The power of the first emission devices 160 and 210 may affect the size of the focal area 214.
“To further control the location of the focal area 214 (and thus the portion of article of manufacture to form), the system 120 may include a substrate actuator system 220 that can move the build chamber 124, relative to the first emission system 160 (and other emission systems). The actuation system 220 is shown in FIG. 8 may be combined with any of these embodiments.”
“The system controller 140 can be communicatively connected to the substrate actuator system 220, such a to an actuation control 222 that acts as a stationary base. It may also contain various processing and control devices. The control signals sent by the system controller 140 can be coordinated with the operation the the first emission device 160 in order to control the movement of the build room 124 via the actuator controller 222. The build chamber 124 can be moved using a movable plate 224 that is connected to the actuator controller 222 via an activation mechanism 226, which could include one or more servomechanisms, and/or other rotating or translational devices. The actuation mechanism 226, which may be used to move the movable plate 224 relative to the actuation control 222 (e.g. the base) or relative to the first emission device 160, can be set up to do so. The focus of the transduced emissions 212 may be kept stationary, while the bulk substrate 14 can be moved relative to it to adjust the excitation region. In certain embodiments, the substrate actuation device 220 can be set up to produce small vibrations or similar to allow the bulk substrate to settle before, during, and after the formation of article 20. It should be noted, however, that any embodiment disclosed herein may allow for some vibrations of the bulk substrate 14, e.g., to create a powder bed, which can assist in powder filling in areas that have been sintered, melted or otherwise altered.
“It is important to understand that the geometry of the manufactured article of manufacture 20 will be affected by the precise location of the focal area. The substrate actuation device 220 can also include a vibration dampening or device to reduce unwanted vibrations in bulk substrate 14.
“As described above, the system controller 140 could include a three-dimensional model containing an article of manufacture stored within the non-transitory storage 144. The illustrated embodiment may cause the movable plate 224 to move according to the three-dimensional model. The actuation controller 222, for example, may cause the movable platform to move via the actuation mechanism 226, in such a way that the focal region 214, can trace the outline of the article 20 using the three-dimensional model. The article 20 may then be written into the bulk substrate using the focal region. Further embodiments allow for the movement of the first emission device 160 or any other emission device in addition to, or in place of, the build chamber 124.
FIG. 9 shows a simplified embodiment of the manufacturing process 120. 9 shows the system controller 140 being communicatively coupled with an emission device actuator system 240 to control the movement of emission devices in order to facilitate the formation 20 of the article. The system 120 can include one or more emission devices, as shown (e.g. the first emission device 160, and the second emission gadget 162). The emission devices can be moved using actuating arms 242, 244 or any other mechanism of the emission device actuator system 240.
“The illustrated emission device actuation systems 240 is meant to be any configuration that can automatically move one or more emission devices with reproducibility. The emission device actuation systems 240 could include servomechanisms that can be controlled by remote or local processing devices. These may correspond to the system controller 140, or another controller designed to control movement of the emission units. The emission device actuation systems 240 may include various features that control operating parameters, such as power, pulse rate, intensity, and other parameters of the first or second emission devices 160, 162. The system controller 140, for example, may coordinate movements of the first, second and third emission devices 160 and 162 by the emission system actuation 240. This coordination is made possible by movement of the bulk substrate 14 by the substrate actuator system 220. This allows the system controller to control which section of the substrate 14 is subject to focused emission from the first or second emission devices 160 and 162. These movements may be coordinated by the system controller 140, which can also coordinate emission parameters.
“As also shown in FIG. 9 shows how the emission device actuator system 240 can move the first and second emissions devices 160, 162 into an arrangement in which their respective emission 164,166 overlap. This may lead to, for example, constructive interference between the first and second emission devices 160, 162 within the build chamber. One aspect of the present embodiments states that the overlap between the first and second emission 164,166 (and other, as appropriate), may be controlled to promote vibration and heating within bulk substrate 14. (e.g. due to constructive interference or harmonic oscillations or phonon generation). The illustrated embodiment shows that the combined emission 246 can be controlled to increase peak pressure, vibration and/or heat intensity at specific locations within the bulk substrate 14. This may be called a focal area 247. As shown, the focal region 247 can be moved to correspond with a surface outline 248 in the article of manufacture 20.
“To increase the speed of manufacturing articles, certain embodiments may include emission devices that are positioned in various positions relative to the chamber 124. As shown in FIG. 10. As shown in FIG. FIG. 10 shows an embodiment of system 120 that may include first and second emission devices 160 and 162 respectively, which are designed to direct first and second emissions, 164, and 166 toward the third and first sides, 192, and 126, respectively. A third emission device 260 is also included in the system 120. It can direct a third emissions 262 towards a fourth side of the build chamber. 124. The fourth side, 264, is located crosswise to the first and second sides 126,192. The system 120 also includes multiple emission devices. Each device is designed to direct an emission in a crosswise direction relative to the other emissions. It should be noted, however, that the build chamber 120 may be any geometry such as curved (e.g. a geodesic dome), or polygonal with any number of sides. The number of sides, emission devices, or associated emissions required to make an article are not limited.
According to certain embodiments, the first, second and third emissions 164-166-262 are emitted in a way that encourages interference (e.g. constructive) in specific regions (e.g. a focal area) of the build chamber. 124 The interference could cause the emission amplitude modulation 164,166, and 262 or vibrational or phonon generation in the bulk substrate 14. This amplitude modulation can cause high energy vibrations or high pressure shockwaves within the bulk substrate 14, causing otherwise unconnected portions (e.g. separate powders, particulates or pellets) of the bulk sub-substrate 14 to be combined via sintering or melting or another similar process.
“In some other embodiments, one, two, or three of the first, third, and fourth emission devices 160, 162, 265 may be used to position the bulk substrate 14. One or more of the first, third, or fourth emission devices 160, 162, or 260 can be used to position the bulk substrate 14. An alternative method of positioning one or more emission devices may be to excite to sinter, melt or trigger some other combining process.
The first, second, or third emission 164,166, and 262 can be either acoustic or optical. In certain embodiments, system 120 may combine optical and acoustic generation of phonons within the bulk substrate 14. This will encourage the amplifying of selected vibrational modes. These vibrational modes can be used to focus vibration and heating within a region 14 of the bulk substrate 14, sufficient to cause material mixture through melting, sintering etc. As described above, the focusing can be achieved by interconnecting the emissions and/or intersecting pressure waves from the emissions. This is possible using, for example, the emission device actuator system 240 or the substrate actuation systems 220. This allows you to control where excitations or emissions intersect, which in turn can affect the location where article 20 is formed.
“In one aspect, the present disclosure may allow for interference between excitations or emissions to be directed along the outline of the article as shown above in FIGS. 6-9. Another aspect is that the interference can produce complex geometry 266 which corresponds to all or part of article 20. The system controller 140 may excite a particular region of bulk substrate 14 in the build room 124, but not a symmetrical focal area or region. The complex geometry 266 could represent multiple faces, e.g. two or more faces of the article-of-manufacture 20, and is generated by the three-dimensional projections of interfering wavesforms (e.g. optical, acoustic, or pressure waveforms) in the bulk substrate 14.
Summary for “Phonon generation from bulk material for manufacturing”
“The present techniques pertain to the field methods of producing articles of manufacture such as additive manufacturing.”
This section is designed to introduce the reader, in a brief manner, to the various aspects of art that might be connected to the present disclosure. These aspects are described and/or claimed below. This discussion will provide background information that can help the reader better understand the various aspects of this disclosure. These statements should not be interpreted as prior art admissions.
Many of the goods and products we use today, simple or complex, were made from basic materials like metals, polymers, ceramics and metals. These materials are also used in certain advanced materials that have been developed by cutting-edge research. There are many ways you can use these materials to make useful products. Polyolefins are a broad class of polymers that can be used to make useful items. They can be used as retail and pharmaceutical packaging, as well as food and beverage packaging, such as bottles and juice bottles.
“Another example is ceramics or metals that can be brazed and drawn, melted and pressed, soldered and sintered, welded and so forth using certain specialized equipment to create different types of ceramic or metallic items. These ceramic and metallic items can be simple as floor tiles, conductive wires, or more complex articles like semiconductor devices.
“In these examples, consumer products are manufactured on an industrial scale using manufacturing equipment that can mass produce them. A mold can be filled with molten plastic to make cups. A blow molding device can be used for bottles. And, wire may be drawn using molten and softened metals by specific types of dies. The capital required to manufacture these articles of manufacturing on a large scale is often very high due to the cost of specialized equipment. The cost of producing articles of manufacturing does not stop at the production line. These articles need to be packed and shipped to customers. Customers may either use them as-is or subject them to further manufacturing.
In settings where mass production is not an issue, some equipment may use one or more of the materials mentioned above to make specific items such as prototypes. For example, some manufacturing systems might produce these items by depositing a manufacturing substance on a substrate and causing it to mix with the substrate layer-by-layer. The substrate can be different from the manufacturing material. This process can be compared to printing. A device may be used in the same way as a printer head, by simultaneously delivering small amounts of material onto a substrate and causing the substrate to mix with the material by providing enough energy to the material to cause it melt, react or any other similar effect. These techniques are often referred to as “3D printing.”
Although 3D printing is capable of creating three-dimensional structures, it can take many hours to complete. The print head must print every layer of the article using a repeating process. Each layer is printed on top and then the next layer, depending on how many layers are being printed. While these techniques are capable of creating unique items, they don’t usually have the ability to meet the demands of setting up production times that exceed a few hours. 3D printing has not been accepted as a commercially viable method of producing consumer goods due to its low throughput.
“Considering the limitations of current manufacturing methods, it is now acknowledged that it might be desirable to design systems capable of producing different types and in a faster manner. It is possible to design individual articles of manufacture in a manner similar to 3D printing, while still forming them at the same speed as commercially-produced manufacturing devices.
Below are descriptions of one or more embodiments of the disclosure. The specification does not cover all aspects of the actual implementation. This is to make it easier for readers to understand. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. It should also be noted that although such a development effort may be time-consuming and complex, it would still be routine design, fabrication, or manufacture for people of average skill who have the benefit of this disclosure.
“The terminology used in this document is intended for the description of particular embodiments and is not meant to limit examples. The singular forms?a,?an, and?the? are used herein. The singular forms?a?,?an???? and?the?? are intended to include the plural forms. Unless the context indicates otherwise, the plural forms are to be used. The terms “comprises”,? ?comprising,? ?includes? and/or ?including,? When used herein, these words indicate the presence of the stated features, integers and steps, operations and elements and/or their components. However, they do not preclude the addition or presence of other features, integers and steps, elements, or components.
Traditional manufacturing methods must balance design flexibility and production throughput, as stated above. Commercial production facilities can produce large quantities of a specific article of manufacture in relatively short time frames, but the equipment required for this high throughput is expensive and difficult to replace. This means that equipment at a specific site is used to produce specific products with very little variability. Many commercial production facilities have a low tolerance for variability.
On the other hand, manufacturing systems that allow for greater flexibility in product design such as additive manufacturing systems must balance this flexibility with high throughput. For example, additive manufacturing systems produce articles of manufacture by printing each layer using a printhead. This may deliver the base material as well as certain types or emissions (e.g. infrasonic. sonic. ultrasonic. hypersonic. optical. electron beam. heat) to the deposited layers to allow them to bond with an underlying substrate. This results in articles of manufacture that take longer to produce than is commercially possible, except for very special items (e.g. cost).
The present disclosure addresses these drawbacks and others of traditional manufacturing systems by using specific types of sound, heat, and light emission to?write?” An article of manufacture is transformed into a bulk substrate. This could be a bed of grains or another collection of material. Excitations can be generated in bulk substrates by using sound, light and/or heat emission. The excitations are directed to specific geometries within bulk substrates so that the article of manufacture is formed entirely or partially.
“Specifically, the present embodiments address manufacturing systems and methods that use projected emissions to form articles in place. This is in contrast to traditional manufacturing techniques which require layer-by-layer printing. In one embodiment of the disclosure, certain types of emissions may be directed at a solid material to generate vibration and heat. Emissions that are specifically tuned to a particular solid material may cause vibration or heating. The emissions interact with the solid materials to generate phonons within individual granules. Phonon propagation can also be observed between granules in some embodiments. The emission may be directed in one or more directions towards the solid material. It may be optical, acoustic, or any combination of both. Certain embodiments using acoustic emission may use the mechanical wave properties to generate localized pressures and/or heating in order to create specific areas of an article of manufacturing. Acoustic and optical emissions, as well as similar ones, may be used in further embodiments to generate phonon generation, propagation, and optical phonon generation. Certain emissions can be controlled to cause portions of bulk materials to resonate at frequencies sufficient to trigger a transformation that results in an article of manufacture. (e.g. by controlling phonon propagation and/or generation).
“Another aspect of the disclosure is that embodiments of a manufacturing process may use interfering optical emission to provide enough energy to bulk substrates to induce certain optically-initiated chemical reaction such as curing, polymerization or the like. These embodiments can be used in conjunction with other methods, such as those that use acoustic emission.
“A further aspect of this disclosure is that embodiments of the manufacturing process may use a metamaterial to act as an optical and/or acoustic waveguide. This allows for specific areas (e.g. focal regions) of bulk substrates to be addressed individually (e.g. selectively excited). Directed excitation can allow all or part of an article to be written into the bulk substrat. Metamaterials can be acoustic, acting as a phononic crystalline. However, only certain wavelengths may pass through them. These acoustic materials can be used to create masks for sound waves, so that specific portions of bulk substrates are excited. The metamaterial can also be present in liquid crystalline materials (e.g. LCD liquid crystal display), where the “pixels” are? The display’s metamaterial may also be present as a liquid crystalline material (e.g., in a liquid crystal display, LCD), where the?pixels? serve to direct, direct, block or otherwise act as a gate for emission through the display (e.g. template, mask, etc.) and into bulk material. Any of the embodiments herein that use a dynamic template should be considered. They may have one or more screens that are adjustable or non-adjustable and can be programmed to be open, close, focused, etc. so that one or several emitters can generate concentrated energy in a region or point within a chamber.
It is possible to design manufacturing systems that can produce articles of manufacture with a variety of outer geometries and almost any material. Manufacturing systems may be able to produce articles of various complexity, such as food and beverage containers, high-tech prototypes and food preparation (e.g. using emissions directed towards edible material).
“Further,” because these techniques can be applied on different scales, it’s also possible that manufacturing systems according to the present embodiments could be used by small businesses or individuals. Instead of purchasing individual articles of manufactured goods from warehouses or commercial suppliers, a consumer can purchase bulk quantities of base material that can then be used to build articles of manufacture as needed. It may be possible to produce items on-site in the environment they are intended. This could reduce shipping and storage costs. It may be possible, for example, to make playground equipment out of polymer pellets or granules and/or powder on a playground site. Or to make vehicle parts at a site that builds vehicles.
“In a general sense, the present disclosure enables the manufacture of individually-designed items from a bulk material, which may be referred to as a bulk substrate, using emissions directed toward the bulk material in a controlled manner. Depending on the type of emission used, the emissions can cause bulk material to combine in a way that is consistent with its chemical or physical characteristics. Referring to FIG. FIG. 1 shows a schematic representation for a process 10. This is representative of how an additive manufacturing system might produce an article of manufactured using focused emissions. The process 10 may use an emission system 12. This is generally designed to direct emissions towards a bulk substrate 14. In controlled fashion, this allows for optically, thermally and vibrationally-driven processes to occur in the substrate. In embodiments where the emission system 12 causes phonon generation/propagation in the bulk substrate 14 to facilitate desired product formation, it may be referred to as a phonon generation system. Bulk substrate is a term that can be used to describe a variety of bulk substrates. This term “bulk substrate” can be used to refer to granular substrates, layers, and other substrates that could be affected by the chemical or physical transformations described in this document.
The emission system 12 could include one or several emission devices that emit energy (e.g. optical, vibrational or thermal), capable of interfacing with bulk substrate 14 (e.g. to cause vibration and/or heat in the materials) and/or one of the features of a focus system to adjust (e.g. to amplify and/or transform emissions into emission of an alternative frequency or wavelength). One or more control devices may be included in the emission system 12, such as a single control system or a distributed control system. This control system coordinates emission from the emission devices and various other devices within the system 12. The emission system 12 could include systems or devices that focus one or more beams on a specific area of the substrate 14 rather than the entire substrate 14. Additional or alternatively, features may be added to the system 12 to limit the emission to a specific area of the substrate 14.
“The bulk substrate 14 can contain any combination or one of the materials that is capable of undergoing a physical or chemical change due to interactions with the emission from the system 12. Materials may also be called ‘phonon-reactive’. Materials that are phonon-reactive can be defined as materials that generate enough heat or vibration to cause product formation. Another example is photo reactive materials. These materials can melt according to a specific vibrational frequency or include materials that can be sintered by heat and vibration (e.g. metals, ceramics). The present disclosure does not apply to all types of materials. It is intended for illustration purposes only. The bulk substrate 14 could include a metal, a clay (e.g. metal oxides, semimetal oxides), clay or glass, a plastic resin such as a pololefin resin, a pololefin resin, e.g. polyvinylrene resin, polystyrene resin), an elastomer (e.g. polydimethylsiloxane, polybutadiene), and polyphenylenesulfide, (PPS), sulfide, and so forth).
The substrate 14 can be found in many morphologies. It may be dry, in suspension or in a solution. When the substrate 14 is dried, it may be in the form of granules. This is meant to include powder, pellets, or flakes. If the substrate 14 material is in solution, it may be present as a solute. This may allow photocatalytic and other optically-driven processes, such as heating, to be performed in accordance the present disclosure.
The bulk material can be placed in a housing or chamber to allow for the accumulation of substrate 14 in a way that facilitates the described processes. These features can be called a “build chamber”, which can be connected to different systems to fill and drain the chamber. This will allow sufficient transmission of the device emission to the emission system 12 to interact the material.
“Moving left to right in FIG. 1. The process 10 includes the step of directing controlled emission (step 16), toward the substrate 14, which can result in phonon generation/propagation or other controlled excitation of substrate 14. For example, during phonon generation/propagation, one or more emission devices of the emission system 12 may emit some type of energy that causes vibration in certain areas of the bulk material of the substrate 14. The phonons may be either thermal, optical, acoustic or a combination of both depending on how they interact with the material. According to the art, thermal and optical phonons correspond to random vibrations within a lattice of atoms and molecules. Acoustic phonons correspond to coherent wavelike vibrations within the lattice structure. Optical phonons correspond to vibrations where the first and second types of atoms move in opposite directions. The overall thermodynamics of a lattice is affected by the sum of these phonons. These phonons can be used to produce vibration and/or heating within the bulk substrate 14 in accordance with an embodiment according to the present disclosure.
“As shown in the emission step 16, a region with a pattern 18 in the substrate 14 (a focal region for the emission devices of emission system 12), undergoes a transition between an initial state and a state in which one of several materials (e.g. One or more atoms are excited. The device emission can cause materials in the area 18 to transition from a ground or other state to an excited condition. This excited state may result in, for example, phonon generation by a lattice made of the material. Alternately, controlled emission according to step 16 could be acoustic emission that causes wave propagation through bulk substrate 14 and to the focal point or region. In certain embodiments, the collective excitation of molecules and atoms at the focal point or area may result in wave propagation through the bulk substrate 14. The wave can have quantized properties that can then be used to cause the chemical or physical change required herein to make articles of manufacture. Three-dimensional excitation, such as excitation along a length and width, may correspond to a desired pattern that corresponds to all or part of a product.
The emission process can be stopped after the 16th step is completed. This could be a result of no further excitation in the bulk substrate 14. A manufacture part 20 can be produced after the excitation period is over.
“The manufactured part 20 can be isolated using a process shown in FIG. 1. Bulk substrate removal (step 22). Bulk substrate removal may, for example, include the draining of a solution of bulk substrate, powder removal or pellet removal, flake and the like. It should be noted that acts performed in accordance to step 22 results in isolation of the manufacturing part 20.
“While the embodiment described above in relation to FIG. While the embodiment discussed above with respect to FIG. 1 can be applied to many manufacturing techniques, this discussion is primarily focused on additive manufacturing. It should be noted, however, that the disclosure also covers subtractive manufacturing techniques. FIG. 2 illustrates an example of subtractive manufacturing. Schematically, FIG. 2 shows a process 30 for subtractive manufacturing. A process 30 could use an embodiment of the emission method 12, which is similar to that shown in FIG. 1. However, it can be used or may use different energies or intensities or other emission parameters to cause cleavage from one part of the substrate.
The process 30 could use the emission system 12 in order to refine a rough-machined part 32. Any solid material that can interact with the emissions from the emission system 32 is considered a rough manufactured part. The rough manufactured part 32 could include, for example, a block made of polymer resin or a ceramic block. It may also contain a more refined article of manufacturing, such as an additively formed rough part. The additive manufacturing techniques include light-based additive manufacturing and ultrasound additive manufacturing. In these cases, layers of the substrate are placed on top of each other to create the rough manufactured part 32. The process 30 is different from these techniques in that instead of building up parts, or essentially adding pieces to the part, the process uses emissions sufficient for portions to be removed. The process 30 follows the same steps as FIG. 1. in directing controlled emission toward the substrate 14 (16).
“The emission according to step 16 of FIG. However, FIG. 2 differs from the one shown in FIG. 1. The excitation takes place in a part 32 that has been manufactured and is used to remove material. The controlled excitation can cause vibration, shock and pressure in certain embodiments. The boundary 34 of excitation is generated by controlled excitation according to step 16. The boundary 34 can be used to define the geometry, shape, and size of a refined manufactured piece 36. After controlled excitation has been performed for a specified time, the refined manufactured parts 36 are produced. Controlled excitation can, for instance, cause vibrations in the base material (e.g. an adjustment in frequency of atomic oscillation). This may be sufficient to remove certain sections from the part 32 and create patterns in the part 32 (e.g. the boundary 34 of excitation). This process can also be used in creating designs, indicia and so forth in the refined manufactured 36.
“Because the refined part 36 is made from a solid bulk material it can be isolated (step 38). This is done by simply removing the remaining rough part 32. The scrap material from the process 30 can be used as a recycling feed in certain instances.
“While the above described the present methods in the contexts of additive and subtractive manufacturing, it is important to note that the present disclosure could also apply to methods for combining different parts to create multiple combined products. FIG. 3 illustrates an embodiment of such combination process 50. The emission system 12 may be used to combine a first manufactured piece 52 with a second manufactured piece 54 to create an article of manufacture.
In a general sense, the first two manufactured parts 52 and 54 can be considered to have been made from base materials such as metals, polymer resins, ceramics, etc. The manufacturing process for the first and second manufactured parts 52 and 54 could have included blow molding, extrusion, sintering and molding. This is not limited. According to the present disclosure, excited areas (e.g. regions of certain phonons), are generated in the first 52 and second 54 parts, or a combination of both. The excitation areas may be the regions where phonons can be generated and/or propagated. These phonons have an energy sufficient for vibration and heating the first and/or the second parts 52, 54, so that they are combined via melting, sintering or the like. The controlled emission (step 16), will be included in the 50-step process, as described above with regard to FIGS. 1 and/or 2.”
“As shown in the figure, the first manufactured piece 52 may have an initial boundary 56, and the second manufactured piece 54 may have another boundary 58. The region of overlap 60 is where the weld will be formed. The area of overlap 60 does not necessarily have to be the one where the first boundary 56 is in alignment with the second boundary. The region of overlap 60 could be simply one where the boundaries 56 and 58 are in direct abutment to one another. To facilitate discussion, however, the current technique is described with one or two manufactured parts 52 and 54 placed over each other to create the overlap 60.
“As shown in the figure, the emission system 12, after performing the step controlled emission 16, may produce an area with a pattern excitation 62. The region of overlap 60 may have a different size, shape or other geometrical parameter than the pattern of excitation 62. The pattern of excitation may not correspond to the size or shape of the area of overlap 60. However, it may cover a small portion of the overlap 60. It is possible that the pattern of 62 only covers a portion of the overlap 60. As it is currently considered, the first and second manufactured parts 52 and 54 could be sufficiently coupled by a geometries defined by pattern of excitation62. Alternativly, the pattern excitation 62 could be dynamic rather than static. The pattern of excitation 62 could be defined as a region in which excitation takes place on a specific portion of the first or second manufactured parts 52, 54. This region (e.g. the focal region) can be moved during the 50. To couple the first and second manufactured components 52, 54 together, excitation can be done by scanning over the entire region of overlap 60. After excitation ceases completely in accordance to step 64, a combined manufacturing part 66 can be formed. It may also include a joint where the two parts are joined together. A joint 68 can be defined as a region in which the constituents of the first manufactured parts 52 and 54 have been exposed to sufficient excitation (e.g. phonon generation), to melt, sinter or combine in such a way that they are linked together in a substantially permanent manner, or less permanent, if desired.
“The 50 process can be used to make a variety of articles of manufacture. The first and second manufactured parts 52 and 54 could include separate portions in a beverage container, separate sections of a pipe or separate portions from an appliance, separate pieces of playground equipment and so forth. These examples show that the first and second manufactured parts 52 and 54 can be combined to make a single beverage, food container, pipe, appliance, or playground equipment using one emission or a single set overlapping emissions from the emission system 12.
“As can be seen from the above, the techniques described in the present disclosure can produce various articles of manufacturing using one or more emission device that emit light, heat and sound toward one or both of the bulk substrates. One aspect of the disclosure allows for one or more emission devices to be controlled (e.g. A controller can direct the emission towards one side of the bulk substrate 14. FIGS. FIGS.4-6 illustrate, for example, examples of embodiments where a dynamic templates may be used to allow formation of all or part of the article of manufacturing 20 from one side of the bulk substrate 14.
“In particular, FIG. The process flow 70 is shown schematically in FIG. 4 using a particular version of the emission system 12. An emission device 72 may be included in the emission system 12. This device, as will be described in more detail in subsequent illustrations, can be controlled in many ways. According to the present embodiments, the emission system 72 (or any other emission devices) can be a source or source of optical emission, acoustic emission, thermal emission, electron beam emission or, in some cases, multiple emission devices that direct optical, acoustic or thermal emission towards the substrate. Except as noted, the description above and below for the emission device 72 can be taken to cover all of the emission devices listed herein.
“In embodiments in which the emission device 72 produces optical emissions, the emission device or emission devices may include a laser (or other optical source) with sufficient operating parameters to cause the desired process to occur within the bulk substrate. Non-limiting examples of such processes may include melting, photocatalytic reactions, curing, heat generation via vibration and/or thermal phonon generation/propagation, and the like.”
“Emission device 72 may be configured to emit sound waves. The device can include any device that produces one or more tones at one of the desired frequencies such as speakers, piezoceramic disks, or other devices. The emission device 72 can be controlled to produce multiple frequencies at different phases. Some frequencies may be able to cause phonons in bulk substrate 14 to be produced and/or propagated. These phonons may possess certain desirable characteristics that allow them to perform the following techniques. The acoustic emission and the resulting Phonons may have desired properties. For example, a vibrational frequency that can cause enough heat or pressure to form in a specific (e.g. focused) area of the bulk substrate 14 In some embodiments, the emission devices 72 can emit frequencies lower than traditional acoustic frequencies. These frequencies may be amplified or interfered with to cause vibrations in the bulk substrate 14.
“In further embodiments, an emission device 72 could include all or part of an electron laser system. The emission device 72 can use electrons as a lasing media in such embodiments. An element that interacts with electrons can cause acceleration and other types of emission to be generated (e.g. optical, acoustic or microwave). Synchrotron radiation is an example of synchrotron radiation. This includes optical emission from accelerated electrons. You can direct the emissions to the build chamber 16 using certain beam steering features (e.g. electromagnetic devices) and/or other masking and templating elements (e.g. of the emission system 12.
The depicted embodiment includes a dynamic template (74) to allow emissions from the emission device 72 into the build chamber 16. The dynamic template 74 could be considered an optical or acoustic masking device. It may include one or more screens. In a broad sense, the dynamic template 74 is designed to interact with emission 76 from the emission device 72, and produce a concentrated or constrained emission (78). The dynamic template 74 is described in more detail below. However, the dynamic template may also include any device that can block emissions 76 from the emission devices 72 in certain areas. It may also allow certain emissions 76 to pass through in other areas. The shape, size and transmitting characteristics of these areas can be changed by the dynamic template 74, as described herein. The dynamic template 74 can be used to modify which areas of the template 774 are capable of blocking the emissions (or reducing their formation) and which regions of template 74 allow transmission of the emission 76 (or enabling them to form the emissions 75) towards the bulk substrate 14.
“The dynamic template (74) may be, in some embodiments, considered a metamaterial. This is a material that includes many different materials with different transmittance or absorption properties relative to the emissions 76. According to present embodiments, dynamic template 74 could include an acoustic metadata, which is a material that interacts with the emission device 72 in a specific way. According to other embodiments, dynamic template 74 could include an optical metamaterial. This is a material that interacts with the emission device 76 in particular ways. The acoustic metadata of the dynamic templates 74 may include physical features, such as inclusions, that allow certain frequencies of sound through the template 74. The periodic spacing will generally approximate sound wavelengths and frequencies. Similar relationships exist for optical metamaterials, and optical emissions. The dynamic template 74 can include a stack or cards of screens, cards, etc. with regions of different electrical, thermal, and acoustic transmittance. To allow appropriate energy/emissions to flow, individual screens/cards may be moved in relation to each other.
“In general, the dynamic template74 will contain at least two distinct constituent materials. These materials can include solids (e.g. metallic, ceramic, or polymeric), inclusions that are disposed in a matrix such as a liquid-crystalline matrix. The dynamic template 74 can be compared to a liquid crystal display in this manner. Additional details regarding the dynamic template 74 can be found in FIG. 5. The dynamic template 74 can be used in some embodiments as a masking device and a waveguide, such as a phonon waveguide, phononic, or even a crystal phoxonic. The dynamic template 74 can be used to direct light, heat or sound waves, or any combination thereof in controlled ways, towards the bulk substrate 14. The type of emission 76 and the method used for making the article 20, among others, will determine whether the dynamic template 74 is in direct contact with the substrate material.
“Again, the emission device 72, the dynamic template 74 and any control, filtering and/or transducing equipment work together to direct controlled emissions towards the bulk substrate 14. The illustrated process 70 in FIG. 4. The controlled emissions 78 are directed towards layers of a bulk substrate in the illustrated process 70 of FIG. The corresponding geometry may be formed in one layer, which is a departure from traditional additive manufacturing techniques. In accordance with certain embodiments, and as further described below, it is possible to form an entire part at once. This can either be in addition or instead of defining geometries in individual layers. To put it another way, different parts of an article can be formed by a single controlled emission step. This allows for complex patterns and shapes to be created in each layer. A single emission step could be used to create a base for a water bottle, or any other complex geometrical feature. The layers do not have to be of a specific thickness. They can be thicker than layers that are typically made by sheet extrusion techniques. The controlled emissions 78, which are directed towards a first layer 80, of the bulk substrate, will be performed in accordance to step 16.
“This controlled emission produces a first pattern 82 that corresponds to a cross-section from a three-dimensional image. This first layer 80 of bulk substrate will be used to produce the excitation. The first pattern of excitation (82) may be either an optically-induced or acoustically-induced. According to an embodiment, vibrations may be generated by the first pattern of excitation82 to produce localized heating sufficient to write cross-sectional geometry directly into layer 80. The first section 84 of the manufactured piece 20 may be used as the cross-sectional geometry. Any size, shape or other geometrical parameter may be used for the first pattern of excitation (82). These geometric parameters can be controlled in a variety of ways, as you will see from the discussion below.
“After creating the first portion 84, you can add a new substrate layer (e.g. a second layer 86) to the top of the first layer 80 (step 87). The advantage of layer-by-layer approach as shown is the possibility to incorporate different materials into the manufactured article 20. The second layer 86 can be different from the first 80 in terms morphology, size and material composition. The second layer 86 is approximately the same size as that of the first layer 80.
“After the second substrate layer is added, the 70 process may include adjustment of the dynamic templates 74 and continued controlled emission (step 88) The emission device 72 could continue to emit 76 towards the dynamic template. The dynamic template 74 has been adjusted according to step 88. Therefore, the focussed emissions directed towards the substrate could be considered a second focused emission, 90 different from the focused 78. The dynamic template 74 might adjust the size or shape of certain areas to allow the emission 76 through the template. While others block the emission, The result of dynamic template adjustments and continued emission may be a second pattern 92. The second pattern excitation 92 has a general size and/or form determined by the adjustment to the dynamic template 74, and may have a geometry that approximates the cross-section of article 20.
“It is important to note that continued emission may occur in accordance to step 88. The second region of phonon generator 92 may have sufficient energy or sufficient excitation to cause that second region 92 to be connected to the first part of the manufactured part. This could be done, for example, by melting, sintering or curing. In embodiments in which both the first and second polymeric layers 80,86 are present, the second pattern 92 of excitation may be sufficient to cause a portion the second layer (86) to melt and seep into spaces or pores at the boundary 94 between the first part of the manufactured part 84% and the second region 92%. Alternately, in embodiments where both first and second layers 80 and 86 are metallic or ceramic, the second excitation pattern 92 may be sufficient to cause a portion the second layer (86) to melt, weld or sinter and/or seep into the boundaries 94 between the first part of the manufactured parts 84 and the first region 92. In one embodiment, the second excitation pattern 92 may be sufficient to form a metallurgical link between the first and second regions 92.
“As shown in the figure, the above processes can be continued in a series denoted with arrows96 to create an embodiment of the manufactured piece 20. This series of steps 96 could include additional layers of the same, different materials or material morphologies. They may also produce the same, or different types, of emission from the same, or different emission devices. The same, or different patterns or templates of masking can be used. According to the process 70 in FIG., the final product is the article 20. 4. This will depend on the materials used and the number of layers.
The manufactured part 20 can include multiple portions, including the first portion 84 and the second portion 100, which are both produced from the second area 92. A third region, 102, is produced by at least one additional layer deposition and excitation. The manufactured part 20 may be connected using vibration, phonon generation, sintering or melting, or any other method that is compatible with the invention.
“According to the present embodiments, different parts of the manufactured part 20 in FIG. Each of the 4 may be made from a single layer and may have a thickness determined by the materials used for manufacturing. The capabilities of the emission devices 72, the type and configuration of the dynamic templates 74, may affect the thickness of each section. Some materials, for example, may allow a standing vibrational waves to be produced (upon excitation), along specific distances. The distance could correspond to the thickness of the layer and the nature the material. The emission device 72 could also have specific capabilities such as emission intensity or emission flux as well as other emission constraints.
FIG. The dynamic template 74 is used to create layer-by-layer additive manufacturing. However, the present techniques can be applied to other types of additive or subtractive manufacturing. Referring to FIG. FIG. 5 shows an example of the present embodiments. It may include an embodiment 120 that produces the article of manufacture without adding layers or in one step. In certain embodiments, the article may be made by producing three-dimensional excitation within a bulk substrate 14. This three-dimensional excitation corresponds with all or part of the geometry 122 in the article 20.
“The bulk substrate 14 that is used in making the article of manufacture 20 can be placed within a chamber 124. This chamber is designed to hold the bulk substance 14 in a way that suits the manufacturing method. The bulk substrate 14 could be provided as granules such as a powdered bed or a packed arrangement pellets or other similar solid morphology. The bulk substrate 14 can also be present within the build chamber as a solution solute or solid in suspension or slurry. It is possible that certain embodiments described in the present disclosure will enable the formation and precipitation of the article 20 in solution, as discussed below.
“It is important to note that FIGS. The configurations shown in FIGS. 1-4 include configurations where one or more substrate sides (the bulk substrate 14), are exposed to emission from one or several emission devices. FIG. 5 shows an embodiment of the dynamic template 74. FIG. 5 shows the combination of the dynamic template 7 and one or more emission devices to emit from the bulk substrate 14. One embodiment may only include one emission device. In other embodiments, there may be multiple emission devices. One more example is that the emission device 72 may only be an optical device capable of emitting photons with sufficient energy to cause absorption on the bulk substrate 14. This can cause heating, curing, photocatalytic reactions, and the like. Another particular embodiment of the emission device 72 may include sub-acoustic and acoustic emission units that emit sound waves or vibrational waveforms. In some embodiments, the sound waves or vibrational wave may be amplified in order to produce a desired response in bulk substrate 14. (e.g. vibration, pressure, shock) in order to cause sintering or melting. Another, more specific embodiment of the emission device 72 may include only emission devices that cause heating in bulk substrate 14. This could include photon absorption by bulk substrate 14 and an associated rise of temperature sufficient to cause melting. The dynamic template 74 can be used to focus the wide-band emission from the emission device 72 on a particular area of bulk substrate 14. This may cause heating, melting or sintering.
The dynamic template 74 can be placed in contact with one or both the bulk substrate 14 and build chamber 124 or it may be separated from either of them. The build chamber 124 is shown in the illustrated embodiment. It is located at an abutment to a first side (126) of the build chamber 124.
“As mentioned above, the dynamic templates 74 can include a combination or materials that allows selective transmission of emissions from emission device 72 to the bulk substrate 14. The illustrated dynamic template 74 has a matrix 130 and inclusions 132, as shown in the expanded section 128. One embodiment of the dynamic template 74 includes a matrix 130 and inclusions 132 that are transmittive to emissions from the emission device 72. The inclusions 132 can be opaque to these emissions to prevent them from reaching the substrate 14. One aspect of the inclusions 132 could have anisotropic transmittance depending on the orientation they are within the matrix 130. For example, inclusions that are nanomaterials (e.g. iron nanoparticles and nanotubes) may exhibit anisotropic transmittance. In one embodiment, the inclusions of 132 can block transmission of emissions 76 in one configuration while the inclusions of 132 permit the emission to pass through the template. 74 in another configuration. Alternate embodiments may have the transmittive properties of both the matrix 130 or the inclusions 130 reversed. In this case, the matrix 130 becomes opaque relative to the emission while the inclusions 130 are transmittive (e.g. always transmittive).
“As shown in the expanded portion 128, inclusions 132 or the matrix 130 can be controlled to create a guide path 134. In accordance with some embodiments, the guide path 134 may be used as a waveguide to direct emission from the emission device 72 through the dynamic template. 74. This controlled transmission of emissions may allow the dynamic template to direct emission from the emission device 72 to a specific region of the bulk substrate 14, within the build chamber, 124 (e.g. a focal area). The inclusions 132 or the matrix 130 may be included in the guide path 134. Or, it may include both the matrix 130 and the matrix 130. The specific material composition of guide path 134 could depend on the transmittance properties and emission characteristics of the emission device 72. The guide path 134 can be programmed to produce an optical or acoustic material with wavelength-selective and frequency-selective transmittance. The periodicity of inclusions 132 can be controlled to match the desired wavelengths or frequencies for transmitting to the bulk substrate 14. The inclusions 132 can be programmed to have a spatial periodicity that corresponds to the desired bandgap of the waveforms.
The matrix could include liquid crystal materials such as liquid crystals or water, as well as diluents like alcohols, organic fluids, and so forth. Non-limiting examples of inclusions 132 include granules made from polymeric, ceramic, metal, and the like. As an example, inclusions 132 could include nanomaterials like nanotubes and nanoparticles or nanospheres. This includes any combination of carbon, boron or nitrogen, iron or copper.
“According to an aspect of this disclosure, the matrix 130 and the inclusions 132, or any combination thereof, can be considered to comprise all or part of a movable matter within the dynamic template. 74. Any material that can be moved, controlled or oriented using one or more control devices communicating with the dynamic templates 74 is called a movable material. The matrix 130 and inclusions 132 can behave similarly to liquid crystal displays. In this case, either the matrix 130 or the movable material 132, or both, electrical signals generated from a control device are used to position or direct the matrix 130 or both. FIG. 5 shows an example of such a control system. FIG. 5 is a template control circuitry 136.
“In embodiments in which the matrix 130 or the inclusions 132, or both, can be addressed using electric signals, the template circuitry 136 might include one or more electronic circuits that are capable of addressing subsets of the dynamic template (e.g. pixels, voxels). The template control circuitry (136) uses electrical signals to adjust the patterns of the matrix 130, inclusions 132, or both within the dynamic template. This is done to control the transmission of emissions from emission device 72. One example is that the template control circuitry 13 may contain electronic circuits placed around the periphery of the dynamic template 774 or any other arrangement of electronic circuits. As noted, individual pixels and voxels can be used to focus, block, focus, or de-focus the emissions.
Magnetism may also be used to address the matrix 130 or inclusions 132. One example is that the template control circuitry (136) may contain one or more magnet elements, which can be controlled (e.g. energized) to create controlled magnetic fields within specific areas of the dynamic templates 74. The magnetic field may be used to address the matrix 130 and inclusions 132, thereby creating patterns in the dynamic template. These patterns could correspond to one or several guide paths, as shown in the expanded area 128.
“As shown in FIG. “As also shown in FIG. 5, the system 10 may contain a controller (e.g. a system controller 140), which coordinates the operation of dynamic template 74 via template control circuitry 136, and operation of one or more emission device 72. The system controller 140 can include one or more processing device 142 at different locations. The processing devices 142 may also be configured to execute instructions stored non-transitory memories 144. These instructions may contain a variety control operations that allow the system 10 to produce article 20. The system controller 140 can also contain other control devices that facilitate the operation of the emission device 72, the dynamic templates 74, and positioning of the build room 124 in some embodiments. These embodiments will be described in greater detail below.
“In one embodiment, the system controller 140 can be configured to perform computer numerical control (CNC), or other automated processes that produce article 20 in accordance with a three-dimensional model stored in non-transitory storage 144. The system controller 140 can adjust the operation 72’s emission device 72 based on the three-dimensional model. This includes adjustments to its position, emission intensity and flux, frequency of emission, etc. The system controller 140 can control the operation the dynamic template 74, in conjunction with other control actions that are based on the three-dimensional model. The system controller 140, for example, may be used to control an emission source (e.g. the emission device 72 or the dynamic template 74), to cause phonons to be generated in the base material as per the computer model.
“The system controller 140 can adjust the penetration depth of the emissions into the build chamber (124) and therefore the bulk substrate 14. This is a more specific, but not limited example. Alternately or additionally, the system controller 140 can adjust the emission spectrum of 72. These adjustments are possible in cases where bulk substrate 14 contains more than one material. Different materials might have different reactivities at various portions of the emission spectrum. Alternately, it may be possible to adjust the way that emissions from the emission device 72 are transmitted via the dynamic template 74. This could allow for the easier focusing of emissions to different areas of the bulk substrate 14.
“The system controller 140 can adjust one or more operational parameters within the dynamic templates 74. This may be done via template control circuitry 136, to adjust a particular section of the article-of-manufacture 20 that was formed at the specific point in manufacturing. The emission device 72 can focus emissions into areas to trace the geometry of article 20. This could correspond to “writing?” The article 20 is incorporated into the bulk substrate 14. The controller 140 can cause a change in the pattern of dynamic template 74 during manufacturing. This could occur upon the formation of a section of the article 20, which will result in a new pattern within the dynamic template. Also, an adjustment may be made in the article 20 that is being focused. This could lead to the formation of another section of the article 20.
“Additionally, or alternatively, system controller 140 can adjust a periodicity 132 of inclusions (e.g. in a focus region) to adjust which portions the emission spectrum are transmitted via dynamic template 74 (e.g. via the guide path 134) The dynamic template 74 can be used as a metamaterial such as a photonic or phononic crystal. The inclusions 132 in the dynamic template may be placed at a frequency that permits certain frequencies of sound to pass along the guide path (134) and towards the bulk substrate 14. The inclusions 132 can also be used as photonic crystals. They may be placed at a periodicity that permits only certain wavelengths of light to pass through. In certain cases, the dynamic template (74) may also serve as a photonic crystal. This would be a combination of a photonic and phononic crystal capable of controlling both the optical and acoustic emission directed at the bulk substrate. The dynamic template 74 can include periodicities, such as first and second periodicities, that are intended to control respective optical and acoustic wavelengths.
“In one operation sequence of the system 120 the system controller 140 may control operational parameter of both the emission devices 72 and the template. This allows for different sections to be formed in the article of manufacture 20. A solution may form a bottom section 146 of article 20, for example. This could allow the rest of article 20 to rest on the bottom portion 148 in the build chamber 124. As article 20 forms in the solution, it is not dissolved and the article 20 falls out of solution.
“As described further below, article 20 can be formed simultaneously by directing a three dimensional projection into the chamber 124 using, for instance, constructive interference of one or more emission devices, projection using predetermined difffraction patterns, or other techniques. The system controller 140 can adjust the dynamic template 7 to create an interference pattern. The emission device 72 may be activated as a laser to traverse the dynamic templates 74 and create a three-dimensional projection in the build chamber 124. The light can be projected onto a medium to create, for example, an image or portion of article 20 within the chamber 124. The light can be intensified by using constructive interference or other emitters to produce sufficient energy to trigger photocatalytic reactions within the bulk substrate 14. This could result in the article 20 as shown in the image.
“In this context, the dynamic template 74 may cause interaction among multiple wavefronts to allow further control over excitation of bulk substrate 14. This could cause interference to occur in particular places and at certain times. Now, let’s look at FIG. FIG. 6 shows an embodiment of a manufacturing process 120. It includes multiple emission devices. A first emission device 160 is shown and a second emission 162. These are configured to direct first and third emissions 164 and 166 respectively toward the bulk substrate 14. The first and second emission 164 and 166 are directed towards the bulk substrate 14 from one side (e.g. toward the first side of the build chamber 124) and via the dynamic template 74. The first and second emission 164,166 can be optical, acoustic or both. In certain embodiments, they may individually or collectively cause physical or chemical changes in bulk substrate 14 material. A portion of the article 20 may be formed by these physical or chemical changes.
“The dynamic template, as mentioned above, can be controlled by either or both the template control circuitry136 or the system controller140 to generate, for instance, one or more guide tracks that direct emissions towards the bulk substrate 14. The illustrated embodiment may allow the system controller 140 to cause the template control circuitry 130 to adjust the arrangement 132 of the inclusions to create multiple guide paths. This is shown in the expanded portion 170. The dynamic template 74 can form a first and second guide paths 172, respectively, which together may create a combined guide (176) to allow for enhanced interactions between the first and secondary emissions 164 and 166. An embodiment shows that interactions within the combined guide176 can produce a combined emission of 178. This is shown in a second expanded section 180.
“The combined emission of 178 could be caused by constructive interference, destructive interference or a combination thereof from the first and second emissions 164, 166. The combined emission 178 can have many characteristics, depending on the nature of the first or second emissions 164,166, and how they are guided through the paths 172,174. In one embodiment, for example, the first and second emissions 164 and 166 could be acoustic waves. You can select the frequencies and phases of the first and second emission 164, respectively, so that they interact in a predetermined way to produce the combined emission (178) with desired characteristics (e.g. frequency, power).
One aspect of the disclosure is that the combined emission of 178 can be generated in such a way that, when combined emission of 178 deposits energy into the bulk substrate 14, (e.g. an atomic lattice), then the molecular arrangement of 181 vibrates at a frequency and power sufficient for the bulk substrate to melt, sinter or the like at a predetermined spot within the build chamber. Additional expanded region 180 may further illustrate this process. The molecular arrangement 181 could be an atomic or molecular structure such as a crystal structure. It is located within the bulk substrate 14, in the build chamber 124, at a focal point, focal area, or focal point.
“In certain embodiments, when the combined emission is acoustic, the molecular structure 181 may be created by interaction with the combined emissions 178 with a pressure wave. This pressure wave can be used to produce shockwaves that are focused at predetermined locations on the bulk substrate 14. Alternately, the combined emission of 178 could impart energy to molecular arrangements 181 (e.g. a single granule, or a collection, of bulk substrate 14), such that the molecular structure 181 oscillates at the superharmonic frequency associated with the combined emission of 178. Superharmonic oscillations of the molecular arrangements 181 could result in heating the bulk substrate 14 which, in turn, forms all or part of the article of manufacture 20.
“The system controller 140 can cause the template control circuitry to adjust the positions 172, 174, and combined guide 176 during operation of system 120 to alter the portion of substrate 14 that is subject to the combined emission. The system controller 140 could cause the template control circuitry 136, to divide the combined guide path 171 into multiple paths, thereby exposing multiple areas of the bulk substrate 14 the combined emission 178. The combined guide path 176 could be split into divergent paths to allow for the formation of multiple heated regions in the bulk substrate 14.
“In a similar fashion, the template control circuitry 13 may cause the first and the second emissions 164,166 to be directed to multiple combined pathways or to be directed entirely independently through the dynamic template74 and to the bulk substrate 14 in a similar way. Multiple emissions directed simultaneously to the bulk substrate 14 have one technical effect: multiple parts of an article may be made at the same time.
“As in the embodiments discussed above with regard to FIG. “As with the embodiments described above in relation to FIG. 5, the depth of an emission focus (and energy deposit) in the bulk substrate 14, (e.g. as determined by distance between the first side 126, and the second side 182, opposite the first), can be varied by changing parameters of the emission device 160, 162, or dynamic template 74. A periodicity of inclusions 132 in the first guide pathway 172, the second path 174, and the combined guide route 176 may be adjusted to adjust (e.g. filter) the component frequencies of emissions. This acts as a phononic crystalline that allows only certain wavelengths through dynamic template 74. Alternately, you can adjust the power and intensity of emission devices 160, 162, or the interactions between multiple emissions at controlled places.
“Indeed the dynamic template 74 described in relation to FIGS. The 4-6 templates can be used in conjunction with other masking or template features. FIG. 12 shows an example of the system 120. 7. The dynamic template 74 can be used on the first 126 side of the build room 124. A second mask or additional dynamic template, 190, may be used on the third 192 side of the building chamber 124. Multiple masking/templating options may be used to produce different emission sources (e.g. multiple dynamic templates). As shown, the third side 192 is oriented in crosswise relation to the first and secondary sides 126, 182. The additional dynamic template, 190, may be oriented in a crosswise direction relative to dynamic template 74. This configuration could be advantageous to allow emissions to be directed through the dynamic templates 74 and 190, interfering (constructively as well as destructively) within the chamber 124.
“As an illustration, the system controller 140 might cause the additional dynamic templates 190 to create a first pattern 194 (using respective inclusions, matrix and template control circuitry), this may correspond to a three-dimensional or first shape for excitation. The system controller 140 could cause the second emitting device 162 to direct second emission 166 towards the third side of the build chamber. 124 An additional dynamic template, 190 with the first pattern 194, could cause the second emission to 166 to produce the first three-dimensional projection within bulk substrate 14. The first three-dimensional projection corresponds excitation of bulk substrate 14 in a specific region (e.g. the regions of phonon generator in FIGS. 1-3). The second emission 166 in certain embodiments may excite the bulk substrate 14 in an area extending from the third 192 side of the build room 124 to the fourth 196 side of the build hall 124. This region is generally defined by the dimensions in the additional dynamic template 194 and the general boundaries of the first pattern 194 therein.
“At the same, the system controller 140 could cause the first emitter 160 toward the first side of 126 through the dynamic template. In combination with the template controller circuitry 136 the system controller 140 may cause the dynamic templates 74 to create a second pattern (198) using the inclusions 132 and the matrix 130. The first emission, 164, is directed at the bulk substrate 14, through the second pattern, 198. It may interact or interact with an excited bulk substrate 14, to cause a physical and chemical change in the material (e.g. heating, melting, curing). The interaction could result in an increase in the oscillation rate of an atomic layer of the bulk substrate 14, for example. In general, the first and the second emissions are directed in crosswise intersecting directions into the build chamber 124, to cause interference or to increase the emission intensity at focal points and regions of the bulk substrate. This is how one of the emission, e.g. the second emission 166, serves to generate an exccitation template onto which the other emission, e.g. the first emission 164, is projected to create a three-dimensional pattern with sufficient excitation energy for all or part of the article 20 into bulk substrate 14.
“In the illustrated embodiment, the first and second emissions 164 and 166, respectively, would overlap or cause interference to form section 202 of article of manufacture 20. The first and second emission 164 and 166 can be static in certain configurations. However, the dynamic template (74) adjusts the inclusions 130 and/or matrix 130 to move second pattern 198 in a direction 200 to form different sections (including section 212) of the article. The other way it works is that while one emission forms a three-dimensional projection within the build chamber 124, and does not move, another emission scans the area 200 to cause a change of material in the bulk substrate 14. Three-dimensional projection is a term that can be used to describe the phenomenon. As used herein, the term “three-dimensional projection” may be used to refer to either a three-dimensional projection or the effect of an emission on the substrate in three dimensions.
The system 120 in FIGS. 2 and 3 will vary depending on the material of bulk substrate 14 or the intensity of emissions. Articles of manufacture may be formed using the process described in FIGS. 5 and 6. The bulk substrate 14 is then written into the build chamber 124. These embodiments are not like traditional additive manufacturing techniques. Instead, material may be added gradually to the build chamber 124-6 during manufacturing. This progressive addition can be done in certain circumstances, however, for example to settle or introduce new materials into the chamber 124. The use of a dynamic template, as described above, may allow for a progressive formation of article 20 or an “all at once?” Formation of the article 20.”
The dynamic template 774 is a useful tool for controlling, filtering and controlling certain types or emissions from the build chamber 124. However, certain embodiments may not require the use of dynamic template 774. Other features that focus, transduce or filter the emission directed at the bulk substrate 14 can be used in accordance to the present disclosure. They may also be combined with the dynamic template. FIG. FIG. 8 shows a perspective view showing an embodiment of the manufacturing process 120 with such a configuration. The system 120, specifically, includes the first emitting device 160. This device is designed to direct the first emission (e.g., a wavefront) towards a focusing device 220 that is located between the first side of the build chamber 124, and the first emission devices 160. The first emission 164 can be either acoustic or optical. The emission device 160 could be any device that can produce such emission.
The system controller 140 controls at least partial operational parameters of first emission device 160. This includes the timing, power and flux of the first emissions 164. It may also control operational parameters (e.g. tilt, distance relative the first emitter 164 and/or build chamber 124) of focusing device 204. The system controller 140 can be communicatively connected directly to the focus device 210 or to a mechanical actuator (not illustrated) attached to the focus device 210. The focusing device (210) may be used to focus or expand the first emissions 164 in certain embodiments to control the regions of the bulk substrate 14. One aspect of the present disclosure is that the focusing device (210) may be used to transduce and focus the first emissions 164 in order to produce a transduced emission (212). The focusing device 210 can adjust the frequency, phase, or other parameter of the first emissions 164.
“For instance, the first emission 164 could be an optical wavefront and the transduced emission 221 may be an acousticwavefront. The opto-acoustic transmitter may be included in such embodiments. Another example is that the first emission could be an optical wavefront and the transduced emissions 212 may be of another wavelength and/or frequency (e.g. sufficiently tuned to cause melting//sintering in bulk substrate 14).
“In embodiments in which the opto-acoustic transmitter 210 is a focusing device, the 210 may contain one or more materials that absorb the first emission (164), undergo excitation and emit sound or other low frequency signals (e.g. vibration). One example is that the focusing device (210) may contain one or more layers (e.g. carbon nanotubes), which are placed on a lens (e.g. a fused silica optic lens) and designed to absorb the first emission (164). One or more layers may heat up due to this absorbance and transfer heat to additional layers of expandable materials, such as polydimethylsiloxane, (PDMS). The layers of the expandable materials may show thermoelasticity when heat is transferred to them. This can cause rapid expansion and contraction, which in turn generates high-frequency sound waves (e.g. 15 MHz). “The nanomaterials and the elastomer could be placed on the concave surface (or optical lens) of the focus device 210. This may allow for the use of focusing methods similar those used in optics (e.g. using calculations of focal length based upon physical parameters of focusing device.210).
According to the present embodiments, transduced emission212 could produce a pressure wave through bulk substrate 14. A focal region 214 is characterized as having an extremely high pressure relative to its surroundings. This is sometimes called a peak pressure and can lead to shockwaves within the bulk substrate 14. Because of the high and low pressure waves in the bulk substrate 14, non-linear propagation may result in shockwaves within the bulk substrate 14. The shockwave could cause enough energy deposition in the bulk substrate 14 for the focal area 214 to undergo a physical alteration to cause melting, sintering or other similar effects. In certain embodiments, shockwaves may be sufficient to cause portions of predetermined sizes to combine and form an article of manufacture.
The power of the first emission device 160 may control the amplitude and strength of shockwaves generated by the transduced emission. This may be used to implement a pulsed laser equipped with a beam extender. The beam expander can be used to expand the laser’s focus so that it interacts with the entire focusing device (e.g., a whole lens surface) 210. The geometry of the lens (e.g. its diameter and curvature) and power of first emission device 160 may control the location of the focal region (e.g. distance from the first side 124 of the build-chamber 124) within the buildcham 124. The amount of energy that is deposited in the opto-acoustic transducing material and the energy of the emitted sounds waves may be affected by the power of the first emitting device 160. The power of the first emission devices 160 and 210 may affect the size of the focal area 214.
“To further control the location of the focal area 214 (and thus the portion of article of manufacture to form), the system 120 may include a substrate actuator system 220 that can move the build chamber 124, relative to the first emission system 160 (and other emission systems). The actuation system 220 is shown in FIG. 8 may be combined with any of these embodiments.”
“The system controller 140 can be communicatively connected to the substrate actuator system 220, such a to an actuation control 222 that acts as a stationary base. It may also contain various processing and control devices. The control signals sent by the system controller 140 can be coordinated with the operation the the first emission device 160 in order to control the movement of the build room 124 via the actuator controller 222. The build chamber 124 can be moved using a movable plate 224 that is connected to the actuator controller 222 via an activation mechanism 226, which could include one or more servomechanisms, and/or other rotating or translational devices. The actuation mechanism 226, which may be used to move the movable plate 224 relative to the actuation control 222 (e.g. the base) or relative to the first emission device 160, can be set up to do so. The focus of the transduced emissions 212 may be kept stationary, while the bulk substrate 14 can be moved relative to it to adjust the excitation region. In certain embodiments, the substrate actuation device 220 can be set up to produce small vibrations or similar to allow the bulk substrate to settle before, during, and after the formation of article 20. It should be noted, however, that any embodiment disclosed herein may allow for some vibrations of the bulk substrate 14, e.g., to create a powder bed, which can assist in powder filling in areas that have been sintered, melted or otherwise altered.
“It is important to understand that the geometry of the manufactured article of manufacture 20 will be affected by the precise location of the focal area. The substrate actuation device 220 can also include a vibration dampening or device to reduce unwanted vibrations in bulk substrate 14.
“As described above, the system controller 140 could include a three-dimensional model containing an article of manufacture stored within the non-transitory storage 144. The illustrated embodiment may cause the movable plate 224 to move according to the three-dimensional model. The actuation controller 222, for example, may cause the movable platform to move via the actuation mechanism 226, in such a way that the focal region 214, can trace the outline of the article 20 using the three-dimensional model. The article 20 may then be written into the bulk substrate using the focal region. Further embodiments allow for the movement of the first emission device 160 or any other emission device in addition to, or in place of, the build chamber 124.
FIG. 9 shows a simplified embodiment of the manufacturing process 120. 9 shows the system controller 140 being communicatively coupled with an emission device actuator system 240 to control the movement of emission devices in order to facilitate the formation 20 of the article. The system 120 can include one or more emission devices, as shown (e.g. the first emission device 160, and the second emission gadget 162). The emission devices can be moved using actuating arms 242, 244 or any other mechanism of the emission device actuator system 240.
“The illustrated emission device actuation systems 240 is meant to be any configuration that can automatically move one or more emission devices with reproducibility. The emission device actuation systems 240 could include servomechanisms that can be controlled by remote or local processing devices. These may correspond to the system controller 140, or another controller designed to control movement of the emission units. The emission device actuation systems 240 may include various features that control operating parameters, such as power, pulse rate, intensity, and other parameters of the first or second emission devices 160, 162. The system controller 140, for example, may coordinate movements of the first, second and third emission devices 160 and 162 by the emission system actuation 240. This coordination is made possible by movement of the bulk substrate 14 by the substrate actuator system 220. This allows the system controller to control which section of the substrate 14 is subject to focused emission from the first or second emission devices 160 and 162. These movements may be coordinated by the system controller 140, which can also coordinate emission parameters.
“As also shown in FIG. 9 shows how the emission device actuator system 240 can move the first and second emissions devices 160, 162 into an arrangement in which their respective emission 164,166 overlap. This may lead to, for example, constructive interference between the first and second emission devices 160, 162 within the build chamber. One aspect of the present embodiments states that the overlap between the first and second emission 164,166 (and other, as appropriate), may be controlled to promote vibration and heating within bulk substrate 14. (e.g. due to constructive interference or harmonic oscillations or phonon generation). The illustrated embodiment shows that the combined emission 246 can be controlled to increase peak pressure, vibration and/or heat intensity at specific locations within the bulk substrate 14. This may be called a focal area 247. As shown, the focal region 247 can be moved to correspond with a surface outline 248 in the article of manufacture 20.
“To increase the speed of manufacturing articles, certain embodiments may include emission devices that are positioned in various positions relative to the chamber 124. As shown in FIG. 10. As shown in FIG. FIG. 10 shows an embodiment of system 120 that may include first and second emission devices 160 and 162 respectively, which are designed to direct first and second emissions, 164, and 166 toward the third and first sides, 192, and 126, respectively. A third emission device 260 is also included in the system 120. It can direct a third emissions 262 towards a fourth side of the build chamber. 124. The fourth side, 264, is located crosswise to the first and second sides 126,192. The system 120 also includes multiple emission devices. Each device is designed to direct an emission in a crosswise direction relative to the other emissions. It should be noted, however, that the build chamber 120 may be any geometry such as curved (e.g. a geodesic dome), or polygonal with any number of sides. The number of sides, emission devices, or associated emissions required to make an article are not limited.
According to certain embodiments, the first, second and third emissions 164-166-262 are emitted in a way that encourages interference (e.g. constructive) in specific regions (e.g. a focal area) of the build chamber. 124 The interference could cause the emission amplitude modulation 164,166, and 262 or vibrational or phonon generation in the bulk substrate 14. This amplitude modulation can cause high energy vibrations or high pressure shockwaves within the bulk substrate 14, causing otherwise unconnected portions (e.g. separate powders, particulates or pellets) of the bulk sub-substrate 14 to be combined via sintering or melting or another similar process.
“In some other embodiments, one, two, or three of the first, third, and fourth emission devices 160, 162, 265 may be used to position the bulk substrate 14. One or more of the first, third, or fourth emission devices 160, 162, or 260 can be used to position the bulk substrate 14. An alternative method of positioning one or more emission devices may be to excite to sinter, melt or trigger some other combining process.
The first, second, or third emission 164,166, and 262 can be either acoustic or optical. In certain embodiments, system 120 may combine optical and acoustic generation of phonons within the bulk substrate 14. This will encourage the amplifying of selected vibrational modes. These vibrational modes can be used to focus vibration and heating within a region 14 of the bulk substrate 14, sufficient to cause material mixture through melting, sintering etc. As described above, the focusing can be achieved by interconnecting the emissions and/or intersecting pressure waves from the emissions. This is possible using, for example, the emission device actuator system 240 or the substrate actuation systems 220. This allows you to control where excitations or emissions intersect, which in turn can affect the location where article 20 is formed.
“In one aspect, the present disclosure may allow for interference between excitations or emissions to be directed along the outline of the article as shown above in FIGS. 6-9. Another aspect is that the interference can produce complex geometry 266 which corresponds to all or part of article 20. The system controller 140 may excite a particular region of bulk substrate 14 in the build room 124, but not a symmetrical focal area or region. The complex geometry 266 could represent multiple faces, e.g. two or more faces of the article-of-manufacture 20, and is generated by the three-dimensional projections of interfering wavesforms (e.g. optical, acoustic, or pressure waveforms) in the bulk substrate 14.
Click here to view the patent on Google Patents.