Lockheed Martin Corporation (Bethesda, MD)

A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N’-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30.degree. C. to about 50.degree. C.; heating a reducing agent solution that includes a reducing agent, an N,N’-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30.degree. C. up to 50.degree. C.; and adding the heated copper salt solution into the heated reduced agent solution, creating copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N’-dialkylethylenediamine ligand. These copper nanoparticles in the composition possess a fusion temperature between about 100.degree. C. to about 200.degree. C. A surfactant system for the stabilizing copper nanoparticles includes an N,N’-dialkylethylenediamine and a C6-C18 alkylamine.

It remains difficult to form monodisperse copper nanoparticles. The formation of mondisperse copper nanoparticles remains an issue. A thermal CVD route to copper nanoparticles by decompositionof Cu[OCH(Me)CH.sub.2NMe.sub.2] has provided smaller nanoparticles on the order of 7.5 nm, but is not conducive to scale up and has not demonstrated access to even smaller particles. It is beneficial to create new, scaleable and cost-effective ways to production of monodisperse copper nanoparticles that have tiny effective diameters. This invention fulfills this requirement and has a number of benefits.

In some aspects, embodiments disclosed herein relate to a method of fabricating copper nanoparticles that includes: heating a copper salt solution comprising a copper salt, an N,N’-dialkylethylenediamine, and a C6-C18 alkylamine in an organicsolvent to a temperature between about 30.degree. C. to approximately 50.degree. C.; heating a reducing agent solution comprising a reducing agent, an N,N’-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about30.degree. C. to 50.degree. C. up to around 50.degree.

In some aspects, embodiments disclosed herein relate to a composition that includes copper nanoparticles, a C6-C18 alkylamine and an N,N’-dialkylethylenediamine ligand. The copper nanoparticles in the composition possess melting temperatures of around 100.degree. C. to around 200.degree. C.

In some aspects, embodiments disclosed herein relate to a surfactant system for the stabilizing copper nanoparticles that includes an N,N’-dialkylethylenediamine and a C6-C18 alkylamine.

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