A package substrate, including an underlying substrate, a second structure disposed on the substrate and featuring a first through-portion, a wire layer disposed in the first through-portion of the substrate, a first insulating layer placed in the first through-portion of the substrate and that covers at least a portion of the first wiring layer and a second wiring layer disposed on the first insulating layer and a multi-chip packaging that includes the package substrate are included.

Comparable to a situation in where the entire system are made from one silicon die, a case that a die has been divided into chiplets could result in lower costs for manufacturing and lower disposal costs because of low yield. In the current trend of chiplets, technology for interconnecting chiplets have developed. A substrate that includes an interposer made of silicon or a substrate with a silicon-based connector bridge is possible to achieve die-to-die, or an electrical connection. These technologies are necessary for the production of costly silicon interconnects. In addition, in the case of a silicon-based interconnectbridge, a reliability issue arises due to a coefficient of thermal expansion (CTE) that is not in line with the silicon material of the bridge and the organic material of a substrate.

One aspect of the disclosure is to provide a package substrate, capable of providing a cheap multi-chip interconnection, and an integrated multi-chip package that includes the same.

The present disclosure also offers a package substrate that can lower the risk of yield reduction as well as a multichip package which contains the same.

Another aspect of the present disclosure is that it provides a package substrate, having an extremely wide range of flexibility in wiring design, and a multi-chip package including the same.

Another feature of the present disclosure is the provision of an improved package substrate that has better reliability, advantageous for bending control, and a multi-chip package that contains the same.

Another aspect of the present disclosure is to provide the possibility of a package substrate capable of creating a compact structure and an integrated multi-chip package that contains the same.

According to an aspect of the present disclosure, a fine circuit can be constructed by forming an elongated dam-shaped structure over an object and then sequentially creating a wiring layer as well as an insulating layer and so on, in a through-portion provided throughthe structure.

For example, a package substrate is the substrate, a first structure that is placed on the substrate, and comprising one through-portion, the first wiring layer that is disposed in the first through-portion on the substrate as well as a first insulating layers placed in the first through-portion of the substrate, and covering at least a part of the first wiring layer and another wiring layer that is disposed on the first insulating layer.

A multi-chip device includes a substrate including a substrate, the first structure is placed on the substrate with an initial through-portion and a first wiring layer located in the first through-portion of the substrate, afirst insulating layer disposed in the first through-portion on the substrate and covers at least a part of the first wiring layer, and an additional wiring layer placed on the first insulating layer a first semiconductor chip disposed on the package substrate and having first connection pads, and a second semiconductor chip disposed around the semiconductor chip on the package substrate and with second connection pads. Through the first wiring layer, at least one of the second and first connection pads is connected electrically to the other.

For example, a package substrate may include the substrate with a dam-shaped structure that is disposed on the substrate initial patterns that are disposed inside the dam-shaped structure and on the substrate second patterns disposed outside the dam-shaped structure andon the substrate and an insulating layer that covers only the first pattern between the first patterns and second patterns as well as a wiring layer on the first layer of insulation, and a via layer disposed in the first layer of insulation and connecting thefirst patterns to the wiring layer.

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Patents are issued by the government to safeguard the invention. The patent grants the inventor the right to develop, utilize and market the invention. Society benefits when new technology is introduced to the market. Benefits can be realized in directly, in that it may allow people to do previously impossible things. Or indirectly through the economic opportunities (business growth and employment) that the innovation offers.

Patent protection is sought out by many universities and pharmaceutical companies to protect their research and development. A patent can cover a physical or abstract product or process , or an approach or composition of materials new to the field. Patent protection must be granted to any invention that is valuable unique, innovative, and not yet known by other people in the same field.

Patents honor inventors who have commercially profitable inventions. They act as an incentive for inventors to create. Small-scale businesses and inventors can rest certain that they will receive the most return from the investment they make in technology advancement through patents. They could earn a decent income from their work.

Patents play essential roles in businesses with the ability to:

Create and protect the latest products and services;

Increase the value, popularity, and appeal of your products on the market

Make your company and products stand out from the rest;

Find out about business and technical information.

Avoid the risk of using proprietary third-party content, or losing important information, creative outputs, or another creative output.

Patents effectively transform the inventor’s knowledge into a commercially tradeable asset, which creates new opportunities for employment creation and growth of business through joint ventures or licensing.

Small companies that have patent protection are more appealing to investors who are involved in the commercialization and development of technology.

Patenting can generate fresh ideas and innovative inventions. The information you create may be eligible for protection under patents.

Patents are a way to prevent untrustworthy third-party companies from earning through the work of inventions.

Commercially successful patent-protected technology revenues can be used to fund research and development (R&D) that will boost the likelihood of improved technology in the near future.

It is possible to use intellectual property ownership to convince lenders and investors that your product has real commercial potential. Sometimes, a single patent could open the door to a variety of financing possibilities. Patents can be used along with other IP assets as collateral or security financing. Investors are also able to view your patent assets to boost the value of their company. Forbes and others have pointed out that each patent can increase company valuation by anywhere from $500,000 to $1 million.

A well-constructed business plan is essential for startups. It must be based on IP and explain what your service or product stands out. In addition, investors will be impressed if you prove that your IP rights are secure or are in progress of being secure and that they align with your business strategy.

It is essential to keep your invention secret until you submit for patent protection. It is essential to keep the invention private prior to making a patent application. A public disclosure could ruin the novelty of an invention and make it patent-infringing. Therefore, prior filing disclosures (e.g. for testing-marketing investors, investors, or for other business partners) must only be done following the signing of a confidentiality agreement.

There are many kinds of patents. Knowing them is essential to protect your invention. Patents for utility cover techniques and machines. Design patents cover ornamental designs. Patents for utility are the best option to protect the proprietor from copycats and other competitors. They are typically issued to enhance or alter existing inventions. Utility patents can also be used to cover improvements and modifications in existing inventions. For example, a procedure patent will cover acts or methods for performing a specific act, whereas chemical compositions will comprise an assortment of ingredients.

What is the length average of a patent? While utility patents are valid for 20 years from the date of their earliest filing, they may be extended by delays at the Patent Office.

Are you looking to protect your idea? Patents are granted only to applicants who are the first to file, therefore you need to file your patent application quickly. Contact PatentPC today to get your patent application submitted!

A patent search is an essential step when you’re working on your patent application. This allows you to see different ideas and provide insight into their creations. You’ll be able to reduce the scope of your idea. Also, you can find out about the technological advancements in the field you’re inventing. This will assist you in know the extent of your invention and help prepare you to file your patent application.

How to Search for Patents

The first step in getting the patent you want is to perform the patent search. You can do a google patent search or do a USPTO search. After the patent application has been submitted, the product that is subject to the patent can be described as patent-pending. you can find the patent application online on the public pair. After the patent office has approved the application, you will be able to conduct a patent number search to find the patent that was issued which means that your product has been granted patent. Alongside the USPTO search engine, you can use other search engines like espacenet, as detailed below. For assistance, consult an attorney who specializes in patents. In the US Patents are granted by the US trademark and patent office or by the United States patent and trademark office, which is also responsible for examining trademark applications.

Are you looking for similar patents? These are the steps you should follow:

1. Think of terms to describe your invention based on its purpose, composition, and application.

Write down a succinct detailed description of your idea. Avoid using generic terms such as “device”, “process” and “system”. Instead, look for synonyms to the terms you chose initially. Then, take note of important technical terms as well as keywords.

Utilize the following questions to help you identify the keywords or concepts.

  • What’s the purpose of the invention? Is it a utilitarian device or an ornamental design?
  • Is inventing a method to come up with something or to perform some function? Or is it a product or process?
  • What is the structure of the invention? What is the invention’s physical composition?
  • What’s the objective of the invention?
  • What are the terms and phrases in the field of technology that describe the nature of an invention? A technical dictionary can assist you to find the appropriate terms.

2. Use these terms to search for pertinent Cooperative Patent Classifications for your invention at the Classification Text Search Tool. To determine the most suitable classification to your invention, go through the resulting classification’s class Schemes (class schedules). Consider substituting the words that you’ve used for describing your invention, if you do not get any results from the Classification Text Search with synonyms similar to the words you used in the first step.

3. Check the CPC Classification Definition to verify the accuracy of the CPC classification you’ve found. The hyperlink to the CPC classification definition will be provided in the event that the title of the classification has a blue box that includes “D” on the left. CPC classification definitions can help identify the specific classification’s scope and therefore you’re certain to pick the most pertinent. They may also provide some search tips or other recommendations that can be useful for further investigation.

4. The Patents Full-Text Database and the Image Database allow you to search for patent documents that have the CPC classification. By focusing your search on abstracts and representative drawings you can narrow your search for the relevant patent documents.

5. Utilize this list of most relevant patent publications to study each in detail to find the similarities to your idea. Pay attention to the claims and specification. Consult the applicant and patent examiner to obtain additional patents.

6. You can find published patent applications that meet the CPC classification you picked in Step 3. You can use the same strategy of searching in Step 4 to narrow your results to the most relevant patent application by looking at the abstract and representative drawings that appear on each page. Next, carefully examine the patent applications that have been published with particular attention paid to the claims and the additional drawings.

7. You can search for additional US patent publications by keyword search in the AppFT or PatFT databases, and also classification searching of patents that aren’t from the United States as in the following table. Also, you can utilize web search engines to search for non-patent-related documents that describe inventions in the literature. Here are a few examples:

  • Add keywords to your search. Keyword searches may turn up documents that are not well-categorized or have missed classifications during Step 2. For example, US patent examiners often supplement their classification searches with keyword searches. Think about the use of technical engineering terminology rather than everyday words.
  • Search for foreign patents using the CPC classification. Then, re-run the search using international patent office search engines such as Espacenet, the European Patent Office’s worldwide patent publication database of over 130 million patent publications. Other national databases include:
  • Search non-patent literature. Inventions can be made public in many non-patent publications. It is recommended that you search journals, books, websites, technical catalogs, conference proceedings, and other print and electronic publications.

To review your search, you can hire a registered patent attorney to assist. A preliminary search will help one better prepare to talk about their invention and other related inventions with a professional patent attorney. In addition, the attorney will not spend too much time or money on patenting basics.