SAMSUNG ELECTRONICS CO., LTD. (Gyeonggi-do, KR)
1. Field of the Invention
Methods that can be used in conjunction with the above embodiments are a means for the production of a semiconductor packaging that has a redistribution coating.
2. Discussion on related art
Through-silicon via (TSV), or a redistribution layer method has been utilized in semiconductor package technology to decrease the size and weight of electronic devices. Because the manufacturing of the TSV and a redistribution layeradditionally involves adhering and taking off the carrier, it can be useful to reduce the complexity of creating a semiconductor packaging.Click here to view the patent on USPTO website.
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