Apple Inc. (Cupertino, CA)
What is a Patent for Conductive PVD stackup design that increase the reliability of electrodes that are deposited
Search Patent for Conductive PVD stackup design that increase the reliability of electrodes that are deposited
Electronic devices are being design with device portability with a view to portability, for instance, to allow users to use these devices in a wide variety of settings and conditions. These devices are designed to work in various environments and locations. They are also subjected to harsh conditions that can affect traditional and standard electronic devices.
However electronic devices are continuing to include increasingly large numbers of functions, many of which may require the device to interact with, or receive information from, the ambient surroundings. The traditional methods of allowing devices to communicate with its surroundings, like apertures or openings inside the housing, which allow sensors to communicate, can be entry points for contaminants. This can result in the infiltration of unwelcome liquids and abrasive particles within the device. This retention or exposure to the environmental substances or conditions could result in an unintentional amount of degrade in the performance or operation of one or more functions of the device. Additionally, these openings or ports can impact the appearance and style of the device in ways that aren’t pleasing to a user.
It is possible to design alternative components or methods that allow communication between the ambient environment components, devices and components for instance sensors that are contained within the internal volume. These sensors do not have apertures and do not expose any portion of the internal volume to elements.
According to some aspects of the disclosed disclosure an electronic device could comprise a housing component that defines an interior surface as well as an exterior surface of the device. A metallic film is formed on the inside surface, and extending atleast partially onto the exterior surface, and a ceramic film is deposited on the exterior surface and at least partly over a portion of the film on the exterior surface. Ceramic film is electrically linked to a portion the metallic film that was placed in the interior.
The electronic device might also include a seal that is able to isolate an inner space from the surrounding environment. The electronic device can also contain an electronic component in the internal space and electrically coupled to the ceramic film, in which the outside surface is exposed to the environment, and the metallic film and the ceramic film form are electrically coupled to the electronic component using the use of conductive ink. The metallic film may contain at least one of titanium or chromium. A carbonitride can be added to the film. The surface inside can have concave geometry, while the exterior surface may contain a convex geometries. Transparent housing components are possible.
A housing for an electronic device may include a conductive coating that is deposited on the first surface of the housing, and then covering at least a portion of the second surface with aceramic. The conductive film and the ceramic film may create an electrically conductive path extending across the firstsurface and the second.
In some instances, the housing can further comprise conductive ink that has been that is deposited on a portion of the conductive film that is deposited on the surface. Physical vapor deposition is a method of depositing at least one of the ceramic films or conductive films. The first conductive layer may be in contact with the first surface, and a second layer can be deposited on the second side at least partially higher than the first. The first layer of conductive material can be created before the second layer, while the ceramic film can be later formed following the first conductive and second layers.
The first layer of conductive material can be as thick as 100 nanometers, while the second film could be as thick as 50 nanometers. Ceramic films can be as small as 1 micron. At least one element of titanium or chromium can be integrated into the material that is conductive. The ceramic material could comprise an nitride that forms the conductive material. An unplanar surface can be utilized as the primary surface. In a CIELAB color space, the ceramic film could have an L* value between 55 and 65.
In accordance with certain aspects, a method for creating an electrically conductive housing component can include depositing a first conductive layer on a first surface of the housing component, then putting a second conductor layer on a second surface ofthe housing component that is opposite to the first surface, the second conductive layer at least partially overlapping the first conductive layer, and then depositing a ceramic film over the second metallic film.
In some examples the conductive layer could include at minimum one element of titanium or chromium and the ceramic layer could comprise a nitride material including at the very least one of chromium or titanium. A housing component may be a primary component of a housing. The method could also be used to seal the interface between the first and second housing components.
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